Search results for "miniaturisation"

In Velden (Austria), AT&S has presented technologies and trends in connection solutions at the 14th AT&S Technology Forum. Numerous interested customers were able to find out about the latest developments in the electronics and printed circuit board industry for areas such as mobile devices, automotive, industrial, communications and medical technology and to exchange views with the AT&S experts.

Japanese researchers describe a new implantable device no bigger than the width of a coin that can be used to control brain patterns. The device, which can be read about in AIP Advances, converts infrared light into blue light to control neural activity and is both the smallest and lightest wireless optical biodevice to be reported.For centuries, it has been known that chemicals can change neural behaviour.

FRAMOS has officially launched the first SLVS-EC RX IP Core for easy sensor interfacing with FPGAs from Xilinx. The proprietary FRAMOS FPGA module available with an Evaluation Kit, connects SONY’s latest high-speed SLVS-EC interface with Xilinx FPGAs and enables vision engineers to seamlessly upgrade to Sony’s interface technology of the future and to create high-performance vision solutions.

Rutronik Inc. will be attending and co-exhibiting at the 2018 IoT World Conference, scheduled for 14th to 17th May at the Santa Clara Convention Center in Santa Clara, California.

Global connectivity solution provider of high performance circular connector and cable assemblies, Fischer Connectorscontinues to push the boundaries of technological innovation in rugged miniaturisation, high speed data transmission, and sealing.

As growth opportunities for providers now offer flexible, versatile, cloud-enabled, and connected test solutions, these can easily be upgraded, and for these reasons Frost & Sullivan believe the embedded market will grow and grow.The embedded instrumentation market is witnessing double-digit growth due to increased demand from the automotive and telecommunication industries and the miniaturisation and complexities of electronic devices.

Designers working on space-constrained applications can now dramatically reduce solution size and increase efficiency with the family of micro system-level IC ('uSLIC') modules from Maxim Integrated. The MAXM17532 and MAXM15462 ultra-small (2.6x3.0x1.5mm), integrated DC/DC power modules are part of Maxim's extensive portfolio of Himalaya power solutions that enable industrial, healthcare, communications, and consumer markets.

The sample shipment of the flash memory microcontrollerusing a 28nm process technology has been announced by Renesas Electronics.To contribute to the realisation of next-gen green cars and autonomous vehicles with higher efficiency and higher reliability, the RH850/E2x Series MCU incorporates up to six 400MHz CPU cores, which according to the company makes it the first on-chip flash memory automotive MCU to achieve the industry's highest processi...

Metcal has announced plans to exhibit in Stand 1F38 at NEPCON China, scheduled to take place 24th to 26th April, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will show its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil, High Thermal Demand solution and Solder Tip Cleaner.

There are more processes that go into printed electronics than you may think. From the production of the ink and pastes to the packaging, here are six companies that exhibited at the trade show for printed electronics, LOPEC 2018, held March 14-15 in Munich, that can provide some insight into the intensive production processes that turn out the technology that is rapidly revolutionising all sectors, from automotive and consumer applications to me...