Search results for "miniaturisation"

Supporting the trend towards miniaturisation, HARTING’s new HCME current sensor series can be directly mounted on busbars. This contributes to shorter installation and an easy pre-assembling of power electronics.Despite the limited space requirements – the dimensions of the devices are 6cm in height and 14cm wide – the HCME current sensors measure high currents up to 5500A with highly reliable precision.

According to KEMET it is the first and only supplier to offer both Class-I and Class-II Base Metal Electrode (BME) MultiLayer Ceramic Capacitors (MLCCs) qualified for defence and aerospace applications by the Defense Logistics Agency (DLA). The DLA recently accepted KEMET's X7R dielectric MIL-PRF-32535 for'M' and 'T' reliability levels.

Following the trend of miniaturisation, HARTING is expanding its M12 family in the field of slim design connectors with HARAX insulation displacement Quick Connect connectors – the slim, field-installable solution for automation technology, which allows fast and uncomplicated cabling on site.The new A and D-coded, 4-pole M12 slim design connectors with HARAXQuick Connect are a great solution within the field of automation technology, especi...

A new water soluble ultra fine pitch Solderpaste, which significantly reduces defects for system-in-package manufacturers has been released by Heraeus Electronics. The spatter-free type 7 (2~11um) solder paste for fine pitch applications is a high-performing paste which enables manufacturers to greatly reduce defects such as solder balling and solder beading.

With the introduction of the iPhone X in September 2017, Apple set the standard for technology and use-case for 3D sensing in consumer. Apple contrived a complex assembly of camera modules and light sources using structured light principles, along with an innovative NIR global shutter image sensor.

The digital world depends on data and that data increasingly comes from networked, intelligent sensor technology. As one of the key technologies for the future developments in IoT, autonomous driving, Industry 4.0, smart healthcare, and smart cities, visitors will find sensor technology in many of the sectors and events at electronica, held on 13th to 16th November, 2018.

Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G mobile communications generation is undoubtedly an overarching and defining trend here, with applications ranging from infrastructure (base stations) to terminal devices (mobile phones), as well as real-time automation scenarios.

Metcal today announced plans to exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, 14th June, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN. The company will demonstrate its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil and Solder Tip Cleaner.

Fischer Connectors is continuing to push the boundaries of technological innovation in rugged miniaturisation, high-speed data transmission, sealing, and wearability.Committed to making lives easier the company has launched a breakthrough plug and use connectivity technology with its new product line, the Fischer FreedomTM Series and its first product, the Fischer LP360TM.

A research team led by physicists at the Technical University of Munich (TUM) has developed molecular nanoswitches that can be toggled between two structurally different states using an applied voltage. They can serve as the basis for a pioneering class of devices that could replace silicon-based components with organic molecules.The development of new electronic technologies drives the incessant reduction of functional component sizes.