Search results for "Toshiba"

Imec has announced at the 2017 Symposia on VLSI Technology and Circuits the world’s first demonstration of a vertically stacked ferroelectric Al doped HfO2 device for NAND applications. Using a new material and a novel architecture, imec has created a non-volatile memory concept with attractive characteristics for power consumption, switching speed, scalability and retention.

Toshiba announces the volume availability of its next MG Series of Enterprise Capacity HDDs providing 8TB for business critical servers and shared storage systems. With a 33% increase in capacity from the previous Toshiba 6TB SATA generation, this drive is the first Toshiba 8TB SATA 6.0Gbit/scapacity-optimized storage for the enterprise. The MG05ACA800 improves sustained transfer rate performance by 12% when compared to the MG04ACA.

PCIM Europe 2017 Stand 9-301 Toshiba has announced two 100V N-channel power MOSFETs, that feature a lower power consumption, due to 4.5V logic level drive, for quick chargers, switched mode power supplies and DC/DC converters.

Toshiba Electronics Europe has announced Toshiba’s debut demonstration of the new 64-layer BiCS FLASH3D technology on an XG Series client Non-Volatile Memory Express(NVMe) Peripheral Component Interconnect Express(PCIe) SSD at Dell EMC World 2017, taking place from 8-11 May in Las Vegas. Toshiba’s latest BiCS FLASH delivers a mature combination of performance, cost and endurance for all SSD types.

According to World Semiconductor Trade Statistics (WSTS), the semiconductor market was down 0.4% in first quarter 2017 from 4Q 2016 and up 18.1% from a year ago. The 0.4% decline in 1Q 2017 versus 4Q 2016 is strong compared to an average four percent decline from 4Q to 1Q over the previous five years. The relative strength in 1Q 2017 was driven by a strong memory market. The three largest memory companies - Samsung, SK Hynix and Micron Technology...

Toshiba has released three ultrasounds in the Aplio i-series, the Aplio i700, Aplio i800, and Aplio i900. The company claims the new devices provide superior imaging, including deep and hard to penetrate regions such as the shoulder. The company’s “iBeam” technology is supposed to provide greater efficiency to the soundwaves, letting them penetrate deeper without losing as much definition as in previous systems.

Toshiba has enhanced its dual-mode BluetoothClassic and BluetoothLow Energy IC technology to offer BluetoothLE4.2 (BLE 4.2) functionality. The dual-mode TC35661-551 simplifies the secure system design of a variety of Bluetooth-enabled products ranging from smartphone accessories and toys to healthcare equipment, industrial as well as automotive sensors and switch solutions.

A new stepping motor driver has been announced by Toshiba Electronics Europe, with an architecture that lowers noise and vibration during motor operation. The TB67S209FTG supports high-speed, high-performance motor control in office automation, banking terminals and home appliance applications.

TQ has extended its x86 product range.The new COM Express Compact module, TQMxE39C2, is equipped with Intel Atom E3900 series processors and, with two DDR3L SO DIMM sockets, offers high flexibility for system integration. A further version, with soldered DDR3L storage and ECC support, is also nearing preparation and will be available from May 2017. For applications with small dimensions, the new SMARC 2.0 module, TQMxE39S, is useful.

TM Robotics, in partnership with Toshiba Machine, announced it has teamed up with ASG. ASG will offer Toshiba Machine robots in both national and international markets.