Search results for "chips"

Gregg Lowe is exiting his roles as Wolfspeed’s President and Chief Executive Officer and as a member of the Board. A search to identify a permanent CEO is underway.

MintNeuro, a pioneer of scalable, low-powersemiconductor technologyfor minimally invasive neural implant applications, has raised £1 million in a funding round led by Empirical Ventures.

Sondrel, a provider of ultra-complex custom chips, has announced the availability of its in-house IP for licensing. This starts with a suite of IP blocks for general SoC management to control start-up of devices, clock and reset control and power domain handling.

Paige West speaks with Rob Moffat, Deputy Director Sales & Business Development Europe at MediaTek about the role of semiconductors in the future of mobile gaming innovation.

Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.

Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.

In2tec's unique technologies are making e-waste recycling an opportunity instead of an obligation.

Texas Instruments has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan.

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.