Search results for "ICs"
Alliance Memory - New Line of High-Speed CMOS Synchronous DRAMs
Alliance Memory, Inc., a worldwide provider of legacy memory ICs for the communications, computing, industrial, and consumer markets, today introduced a full line of new, high-speed CMOS synchronous DRAMs (SDR) with densities of 64 Mb (AS4C4M16S), 128 Mb (AS4C8M16S), and 256 Mb (AS4C16M16S).
Alliance Memory Appoints William Chen as New Sales Representative in Taiwan
Alliance Memory, Inc., a worldwide provider of legacy memory ICs for the communications, computing, industrial, and consumer markets, today announced that William Chen has joined the company as its new sales representative in Taiwan. In his new position, Chen will be responsible for supporting Alliance Memory's distributors and promoting the company's SRAM and synchronous DRAM products in Taiwan and China, a territory that will expand to all of S...
America II to distribute AMIC memory - Leading independent distributor adds new authorised line
America II Electronics, Inc., one of the world’s largest independent distributors of semiconductors and passive components, has finalised an authorised distribution agreement with AMIC Technology Corporation, a world-class manufacturer of memory ICs.
INSIDE Secure and IDT to offer easy-to-design USB security token solution
INSIDE Secure and Integrated Device Technology has announced that the two companies have collaborated to bring to market a compact, single-package secure microcontroller and oscillator solution that significantly reduces the bill of materials when designing USB tokens for authentication and digital signatures.
RFMD, Motorola Mobility and HTC to be Investigated by U.S. ITC based upon Peregrine Semiconductor Patent Infringement Complaint
Peregrine Semiconductor Corporation today announced that the U.S. International Trade Commission has launched an investigation into whether RF Micro Devices, Inc. products infringe certain Peregrine patents relating to RF ICs and switch technology. The action and investigation further include Motorola Mobility, Inc. and HTC Corporation, whose products incorporate the alleged infringing RF ICs.
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation has announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body ...
Mako Networks' award-wining network appliance first to add 3G connectivity
Mako Networks today released a new model of its award-winning Mako 6500 network appliance incorporating a 3G mobile data connection to keep business flowing during ADSL or Ethernet network outages, or offer connectivity in areas not served by fixed-line networks.
Highly Integrated IC Solution for Low Cost 60 GHz Radio Applications
Hittite Microwave Corporation announces the release of the highly integrated HMC6000 and HMC6001 silicon transceiver chipset which targets 60 GHz applications such as: metrocell/picocell backhaul, WiGig (IEEE 802.11ad) multi-Gbps solutions including wireless cable replacement (HDMI, USB 3.0, DisplayPort), wireless docking stations, video/magazine kiosks and wireless sensors.
NXP Powers NFC in the Samsung GALAXY S III
Today, NXP Semiconductors N.V. announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the best-selling Samsung GALAXY S II.
Silicon Labs Acquires Ember, Gains Low-Power 2.4GHz Wireless Mesh Networking Technology
Silicon Laboratories Inc. today announced it has signed a definitive agreement to acquire Boston-based Ember Corporation for initial consideration of $72 million, subject to an adjustment for certain working capital amounts and potential earn-out consideration.