Search results for "thermal"

CUI Devices’ Thermal Management Group announced the expansion of its line of BGA heat sinks.

Investments and expansions at device, epiwafer, and wafer levels are driving growth in the multi-billion dollar SiC power market. Device manufacturers are constructing facilities in various regions.

Vishay Intertechnology has launched its inaugural fourth-gen 600 V E Series power MOSFET in the innovative PowerPAK 8 x 8LR package, aimed at telecom, industrial, and computing applications.

Microchip has introduced the radiation-tolerant (RT) PolarFire system-on-chip (SoC) FPGA for space applications.

In this article, e-con Systems explores the types of camera noise and their impact on image quality.

Driven by net zero goals, more electric vehicles (EVs) are hitting the road, each with a rechargeable battery along for the ride. But an EV doesn’t just represent one less carbon-emitting combustion engine on the road – it’s also a potential energy source if it’s capable of bidirectional charging.

When the development of a product is starting to approach the stage when it will be released for manufacture, extensive testing is usually conducted.

In many applications, such as construction of satellites, aviation, or medical equipment, signal connections need to be extremely reliable and resistant to all kinds of interference and mechanical factors.

Bicker Elektronik GmbH in Donauwoerth/Germany introduces the DC300WS, a contact-cooled 300W DC/DC converter with up to 98% efficiency.

Leader Tech has announced the launch of its product line that it promises will revolutionise the field of thermal management.