Search results for "soldering"
MacDermid Alpha announces launch of ALPHA HRL3 Solder Sphere
MacDermid Alpha Electronics Solutions announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.
SMTconnect 2022 comes to successful close
At the SMTconnect, which took place from 10 to 12 May 2022 in Nuremberg, Germany, around 9,000 qualified visitors took advantage of the reunion to exchange views on trends and to work out solutions for efficient, clean and optimised electronics production in personal discussions.
Mini I/O connector provides shock, EMI resistance
Specialist distributor TTI is now stocking the Industrial Mini-I/O connectors from TE Connectivity.
Passive and electromechanical elements from Panasonic
Panasonic products can be found in numerous parts of the TME catalogue – from simple to complex components of automation systems. This article will provide an overview of the former: basic, passive, and electromechanical components that stand out for their high durability and precise manufacturing.
SMTconnect 2022: heartbeats of electronic production quicken
SMTconnect, which will take place from May 10-12 in Nuremberg offers a highly relevant programme for visitors to the exhibition.
Omni Pro Electronics announces NIC Components’ high-CV capacitor series
Omni Pro Electronics has announced NIC Component’s release of the NAZR Series of surface mount High-CV Aluminum Electrolytic Capacitors.
Capacitors support power applications to 100VDC
Omni Pro Electronics has announced NIC Component’s release of the new NAZR Series of surface mount High-CV Aluminum Electrolytic Capacitors.
Participation in PCIM Europe reflects importance of power electronics
Viscom AG is exhibiting at the PCIM Europe trade fair for the first time this year. The team of experts at Stand 6-110 will provide detailed information about inspection solutions from Viscom for the special requirements of power electronics. Particular highlights set to be shown live is the iX7059 Module Inspection inline X-ray system and high-precision optical wire bond inspection.
Winners of IPC Hand Soldering Competition announced
In cooperation with Southern Manufacturing & Electronics, IPChosted its popular Hand Soldering Competition (HSC), on February 8-10.
Indium introduces adhesive solution for semiconductor applications at PCIM Europe
Indium Corporation announces the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.