Search results for "thermal"

CUI Devices’ Thermal Management Group has announced the official launch of its new thermal design services.

Peters has recently expanded its product range with the introduction of ELPECAST VU 4545/101, a casting compound distinguished by its remarkably high thermal conductivity.

iWave has announced the launch of the iW-RainboW-G61M System on Module, powered by NXP Semiconductors i.MX 95 applications processor.

Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16thMay 2024 in Aurora, Colorado.

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

STMicroelectronics introduced automotive-qualified step-down synchronous DC/DC converters designed to save space and ease integration in applications such as body electronics, audio systems, and inverter gate drivers.

Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.

From 28-30 May, Panasonic Industry Italia will showcase its offerings at SPS Parma in Italy, located in Hall 6 at Stand H008.

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.