Search results for "ASIC"

Fully automated and autonomous vehicles should be able to respond appropriately in every situation. Together with partners in the 'KI-FLEX' project, the Fraunhofer Institute for Integrated Circuits IIS is developing a platform that uses Artificial Intelligence methods to help measure vehicle position and determine vehicle environment in the future.

The demand for greater bandwidth is present in all applications but nowhere is this more apparent than in telecommunications and data communications infrastructures. The use of fibre optics is an effective way of adding bandwidth, but it comes with the requirement of a transceiver module to terminate each end of the cable. By Eric Lan, Assistant Product Marketing Manager of Connect ASIC Product Line, Diodes

Omron Electronic Components has added a wide angle 32 x 32 element version of its D6T MEMS Thermal Sensors, offering the widest field of view that Omron has ever delivered.The new Omron D6T-32L-01A can view across 90.0° by 90.0°, able to encompass a wide area such as a whole room from a single point. This high performance sensor offers contactless measurement of temperatures of 0-200ºC in ambient temperatures of -10-70ºC.

Adesto Technologies has announced it is engaging with the European Space Agency (ESA) through the agency’s ARTES Competitiveness and Growth (C&G) programme to develop technologies for next-generation mobile satellite communications.

There were two slides in Geir Eide’s PowerPoint presentation about Mentor Graphics newly introduced Tessent Connect design for test (DfT) platform that resembled a before and after advertisement. In the first slide IC design teams are using conventional design for test methodology which induces headaches as they try to retrofit flows to use hierarchical components and technologies.

Flex Power Modules announces the BMR4615001/001, a new variant of its popular BMR461 series of digital point-of-load (PoL) regulators. The new module provides up to 15A/50W at an adjustable output voltage of 0.6 to 3.3V, which equates to a 25% higher current and power delivery at 3.3V than the previous 12A maximum for that voltage. The input voltage range of the device is 4.5 to 14V.

After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019 with the combined value of about 20 M&A agreement announcements reaching $28.0bn for the purchase of chip companies, business units, product lines, intellectual property (IP), and wafer fabs between January and the end of August.

CUI Devices have announced the addition of a new series to its innovative AMT incremental encoder family to support larger motor shaft sizes from nine to 15.875 mm. The AMT13 series, based on CUI Devices' proprietary capacitive ASIC technology, brings the same high levels of durability, accuracy, and immunity to environmental particulates as current AMT encoder models.

Two new modules and a test head designed specifically for high-volume testing of devices used in automotive applications have been added to Advantest’s T2000 platform. The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles, a market segment that is projected to have a 9.6% compound annual growth rate from 2019 to 2022.

The latest closed-loop Hall effect current sensors deliver the added performance of fluxgate sensors without the added cost. LEM have recently launched six separate families of LxSR sensors called LXS, LXSR, LES, LESR, LKSR, LPSR.