Search results for "ASIC"

LEM has expanded its range of miniature, integrated circuit sensors range for AC and DC isolated-current measurement with the introduction of the HMSR series. Despite their small size, the components can handle overload current bursts of up to 20 kA (8-20µs surge test profile), such as those that occur in photovoltaics applications while still providing a reinforced isolation. Products in the series are designed to measure currents of up to...

With its newly introduced digital oscilloscope series MSO8000 and MSO5000, Rigol is presenting a significant addition to its UltraVision II oscilloscope portfolio at embedded world 2020 in Nuremberg (February 25-27). The core of the UltraVision II architecture is the Phoenix chip set with two ASICs developed in-house, which build the analogue front end and deliver the signal processing performance.

Smart Production Solutions – SPS, formerly known as SPS IPC Drives, brought companies together once again to share and inform customers and visitors about the very latest in digital transformation, with a particular focus this year on Artificial Intelligence.

After Nanusens’ success at the TechWorks Awards in October where it was the only company to win two awards, the company has gone on to win the Award for Best Campaign of the Year at the 2019 Elektra Awards, which are organised by Electronics Weekly.

BrainChip Holdings has announced that it has been accepted to present a demonstration featuring its Akida Neuromorphic System-on-Chip Technology, recognising and classifying hand gestures from the audience at the 33rd Conference on Neural Information Processing Systems (NeurIPS), at the Vancouver Convention Centre in Vancouver, Canada.

Blaize has emerged from stealth and unveiled a next-generation computing architecture that precisely meets the demands and complexity of new computational workloads found in artificial intelligence applications.

LEM has expanded its range of miniature, integrated circuit sensors range for AC and DC isolated-current measurement with the introduction of the HMSR series. Despite their small size, the components can handle overload current bursts of up to 20kA (8-20 us surge test profile), such as those that occur in photovoltaics applications while still providing a reinforced isolation.

Die temperature of a high performance processors such as a CPUs, GPUs, ASICs, and FPGAs not only initiate a safe system shutdown, but also enable systems to dynamically adjust its performance or control fan speed in the system.

A bidirectional differential pressure sensor for ultra-low pressures has been introduced by Analog Microelectronics expanding the company’s digital board-level pressure sensor series AMS 5915 with I2C output. The AMS 5915-0002-D-B allows the precise measurement of extremely low differential pressure in a pressure range from -250 Pa (-2.5 mbar) vacuum up to 250 Pa (2.5 mbar) overpressure.

Mentor has introduced Tessent Connect – an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods.