Search results for "RECOM"
Pricing pressures is one of the main concerns for EU companies!
In today’s global economy, organisations are facing unprecedented pricing pressures as they deal with volatility in the commodities markets, currency fluctuations and unyielding international competition. To help mitigate the challenges, a number of world-class companies are turning to pricing software recommended by organisations from McKinsey, to Gartner and KPMG. In fact, both McKinsey and Gartner indicate that raising prices by 1-2% reaps m...
Prism Sound Announces a Webinar on Digital To Analogue Converter Evaluation
Prism Sound is hosting an educational webinar on March 14th to discuss the theory and practice of evaluating digital-to-analogue-converter (DAC) performance in audio applications.
Microsemi Corporation Announces Successful Completion of Acquisition of Zarlink Semiconductor Inc.; Offers Extended to Facilitate Acquisition of Untendered Securities
Microsemi Corporation and Zarlink Semiconductor Inc has announced that 0916753 B.C. ULC, an indirect wholly-owned subsidiary of Microsemi, has accepted the tender of and will acquire today 123,438,737 Zarlink shares, representing approximately 96 percent of Zarlink's outstanding shares, and CAD$54,417,000 principal amount of Zarlink convertible debentures, representing approximately 87 percent of Zarlink's outstanding debentures.
Freescale announces RF power LDMOS transistors that cover full frequency bands for wireless base stations
High efficiency and wide instantaneous bandwidth allow network operators to reduce operating and capital expenditures and improve network flexibility
Easier Wireless Embedded Design With Silicon Labs' Next-Gen EZRadio IC's
Silicon Labs has today unveiled two next-generation EZRadio wireless ICs designed to simplify the addition of high-performance wireless connectivity to cost-sensitive embedded applications. The new EZRadio Si4455 transceiver and Si4355 receiver products combine market-leading advances in size, performance and low-power operation with easy-to-use development tools.
UL and ITI Help Chinese Manufacturers Prepare for the Innovative Hazard-based Safety Standard IEC62368-1
Underwriters Laboratories and U.S. Information Technology Industry Council (ITI) presented a seminar that introduces the new international standard IEC62368-1 to suppliers of ITE and A/V products, which helps Chinese manufacturers understand and prepare for the transition to this new hazard-based safety standard.
HUBER+SUHNER - High density fibre connectivity for the evolving SAN network
Connectivity specialist HUBER+SUHNER has now incorporated ‘plug & play’ MTP connectivity to its class-leading LiSA Fibre Management System. The MTP 12 fibre and 24 fibre connectors allow high-density connections within the same footprint as a standard SC connector and can reduce installation and servicing times by up to 75%.
ESSEMTEC to Demonstrate Solutions for the Entire Production Process at the 2012 IPC APEX Expo
Essemtec announces that it will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC — Association Connecting Electronics Industries has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface m...
SEMA and SMTA Solar Manufacturing and Reliability Conference Program Announced
SEMA and SMTA announce the finalized program for the Solar Manufacturing & Reliability Conference, which will take place from March 22-23, 2012 at the Fairmont Hotel in San Jose, CA. The program will consist of presentations and discussions focusing on the reliability testing of PV modules, covering gaps and where future work needs to be done.