Search results for "Rutronik"
Rutronik, TDK-Lambda ink global pact
Rutronik and TDK-Lambda Germany have entered into a global distribution contract that covers the entire product range of TDK-Lambda.With immediate effect, customers worldwide can order TDK-Lambda's AC/DC power supplies (chassis mount, DIN rail and DC/DC converters) from www.rutronik24.com.
Capacitors guarantee higher ripple current capabilities
To meet the market demands for higher ripple current handling, Panasonic has released two new series of aluminium electrolytic capacitors. The V-TC and V-TCU series benefit from higher ripple current capabilities at 125°C and both are available at distributor Rutronik.The V-TC and V-TCU series guarantee from 1.2 to 1.5 times higher ripple current capabilities.
Rutronik presents Bluetooth Smart ICs
Toshiba’s three ICs TC35678FSG, TC35678FXG and TS35679FSG, support Bluetooth Low Energy (BLE) version 4.1 communications. They achieve class-leading low current consumption and are ideal for use in Bluetooth Smart devices, such as wearable technology, medical equipment, smartphone accessories, remote controls and a wide variety of emerging IoT solutions. The new ICs are available at distributor Rutronik as of now.
Wireless chips for IoT applications on show at embedded world
At embedded world 2017 (booth 3A-439), RUTRONIK EMBEDDED is to offer visitors selected wireless chips and modules, displays, boards, and storage solutions characterised by their durability, long-term availability and high integration capacity for industrial and IoT applications.
IC enables batteryless RF communication
Panasonic Automotive & Industrial Systems Europe's range of NFC tags has expanded with the introduction of a new IC for batteryless RF communication which is compliant with JISX6319-4 (212kbps/424kbps), ISO/IEC14443 TypeA (106kbps), and ISO/IEC14443 TypeB (106kbps/212kbps/424kbps) 13.56-MHz contactless IC card standards and therefore guarantees global interoperability.
Bluetooth module suits IoT applications
The powerful high-end Bluetooth v4.2 qualified single-mode „BlueMod+S42“ module from Telit is based on the nRF52 Nordic chip and makesBLE Applications fast and secure. It is available at distributor Rutronik as of now. The new single-mode module BlueMod+S42 issuitable for a variety of IoT applications: from simple cable replacement applications to complex mesh solutions. .
System on Module smooths path from concept to prototype
The new Intel Joule module features high-end compute and graphics as well as a large memory in a tiny, low-power package. This makes it ideal for innovative IoT edge compute applications and products requiring advanced computer vision. The new module as well as the developer kit are available at distributor Rutronik as of now.
Starter kits give flying start to ARM development
With the new ARM-based Starter Kits from Advantech, it takes only ten minutes to start the ARM development, including all key elements of a development environment. The new Starter Kit is available at distributor Rutronik as of now. The new ARM-based Starter Kits powered by NXP and TI processors provide a shortcut for ARM platform evaluation and development.
Dual protocol transceivers are RS-232 compliant
The ISL3333xE/ISL3335xE dual protocol transceivers from Intersil are a family of two port interface ICs where port 1 is configured as dual (2Tx, 2Rx) RS-232 transceiver and port 2 is a single RS-485/RS-422 transceiver. They are available at distributor Rutronik. The new two port interface ICs have an on-board charge pump that generates RS-232 compliant ±5V Tx output levels from a single VCC supply as low as 3.15V (ISL3333xE) and as low as ...
Power MOSFETs are board space savers
With three new n-channel devices in the compact PowerPAK SO-8L-package, Vishay has extended its offering of 600V and 650V E Series power MOSFETs. The new space-saving MOSFETs with high reliability are available at distributor Rutronik. With a compact size of 5x6mm, the Vishay Siliconix MOSFETs 600V SiHJ8N60E and 650V SiHJ6N65E and SiHJ7N65E occupy only half the board space compared to MOSFETs in the TO-252 (DPAK) package.