Search results for "EDA"
Webinars offer advice regarding design suite
Computer Simulation Technology (CST) announces a series of webinars to accompany the release of the 2015 version of CST STUDIO SUITE. The webinars will demonstrate the latest features and tools available and their application to the areas of microwaves, RF and optical, EDA and EMC/EMI and low frequency simulations.
Cadence & ARM launch IP interoperability agreement
Cadence Design Systems and ARM recently announced the signing of a broad IP interoperability agreement. This multiyear agreement provides reciprocal access to relevant IP portfolios from the Cadence IP Group and ARM.
Platforms feature 200 debug & analysis apps
Synopsys now has more than 200 debug and analysis apps available on the VC Apps Exchange portal and in the Verdi VC Apps Toolbox, demonstrating rapid momentum for customised applications that drive continuous innovation and further enable SoC teams to address their debug challenges.
Cloud testing has a DATE in Grenoble
Advantest will showcase its CloudTesting solutions from its group company, Cloud Testing Service at DATE 2015 at the ALPEXPO-ALPES Congress in Grenoble (March 9-13). Backed by Advantest’s 60-year history of measurement technology and innovation, CTS solutions offer the latest high-quality test methods utilising IPs, characterization tools, analysis and more.
Design flow features a virtual die model concept
A design flow solution, which automates the planning, assembly and optimisation of today’s complex multi-die packages, has been introduced by Mentor Graphics. The Xpedition Package Integrator is suitable for IC package and PCB co-design and optimisation. For true IC-to-package co-optimisation, the design flow incorporates a unique virtual die model concept.
SOI technology is gaining momentum
The SOI Industry Consortium announces silicon-on-insulator (SOI) technologies gaining strong industry momentum towards a rapidly growing SOI ecosystem. A robust foundry offer and leading fabless players are demonstrating how simple it is to design and manufacture ICs on Fully Depleted SOI (FD-SOI) and RF-SOI technologies, confirming SOI as a very competitive technology platform for fast-growing semiconductor applications.
CAD software enables complex PCB designs
Farnell element14 is now exclusively stocking Altium’s CircuitStudio software in the element14 Design Centre under the two companies’ global distribution deal. The software rounds out Farnell element14’s CAD offering and enables the company to fulfill the vast majority of software needs for professional design engineers.
Development environment for ARM premium mobile IP suite announced
Cadence Design Systems and ARM have jointly announced the availability of a complete SoC development environment, supporting the ARM premium mobile IP suite that incorporates the latest ARM Cortex-A72 processor, ARM Mali-T880 GPU and ARM CoreLink CCI-500 Cache Coherent Interconnect solution.
Simplify EM compatibility & interference analysis
CST EMC STUDIO, a product for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) analysis, has been introduced by Computer Simulation Technology. Engineers can use the tool to study effects such as radiated or conducted emissions in consumer electronics devices, or susceptibility to ESD, lightning strike and high-intensity radiated fields.
EDAC strengthens European management team
Connector specialist group EDAC has restructured its European sales and customer-service operations with one promotion and the addition of two key team members. According to Alex Grout - who took over the role of European Managing Director last April - the new appointments have been necessitated by the business upswing that has resulted from a significantly enhanced product portfolio and the company's acquisition of UK company MH Connectors.