Search results for "Fraunhofer"
Driving comfort innovations to be showcased at LOPEC 2017
The LOPEC exhibition will be taking place in Munich, Germany from 28th-30thMarch 2017, providing information on the latest products, technologies and trends in printed electronics. This year, the automotive industry will be one of the focal points of the international exhibition and conference.
Remote RF tuner supports worldwide radio standards
Thanks to the remote tuner solution from Maxim Integrated Products, designers can simplify the head unit design of a vehicle and reduce cables. The MAX2175 RF to Bits tuner eliminates the need to rework the vehicle’s hardware to support worldwide radio standards, allowing updates by simply changing the vehicle’s software.
Networking platform for science at HANNOVER MESSE
Cyber-physical systems, a wearable robotic cameraman outfitted with artificial intelligence and the smallest, lightest hydroelectric power plant in the world are just a few examples of the concepts that visitors discovered in the Research and Technology sector at HANNOVER MESSE 2016.
System uses fluorescent dyes to find defects in transparent varnishes
When ultra-thin transparent varnishes are applied on to transparent foil tapes, defects in the coating can now be made visible immediately during the coating process. This is possible thanks to an inline detection system that uses fluorescence dyes which has been developed by three institutes from the Fraunhofer Polymer Surfaces Alliance POLO.
3D printing enables customised insoles for diabetes patients
In the past, insoles for patients with diabetes were hand-made by orthopedic shoemakers. In the future, these specialist shoemakers will be able to produce insoles more cost-effectively thanks to new software and the use of 3D printers. This approach means the mechanical properties of each insole can be assessed scientifically and more effectively.Is your shoe too tight? Normally you would just shift your weight to take the pressure off the area ...
The IP landscape of advanced fan-out packaging
In today's fast-growing fan-out market showing an 80% increase between 2015 and 2017, it is essential to deeply understand the patent strategies of the key players. The Technology Intelligence and IP Strategy Company, KnowMade, has thoroughly investigated the fan-out packaging patent landscape and has released a patent landscape analysis entitledFan-Out Wafer Level Packaging.
Semiconductors connect the real and the digital worlds
At electronica 2016, Infineon Technologies AG presents semiconductor solutions for sustainable success in the IoT. Electronics from Infineon are part of our everyday lives already today and even more tomorrow. Sensors, microcontrollers, power semiconductors and security solutions are the building blocks to make connected devices and IoT systems smart, safe and energy-efficient. For example, around 80% of innovation in automotive applications is b...
Passive and active devices on show at micro photonics in Berlin
This year’s micro photonics will see the Fraunhofer Heinrich Hertz Institute HHI presenting its latest solutions of photonic components. Fraunhofer HHI enables an own design of InP-based Photonic Integrated Circuit (PIC) containing passive and active devices on one substrate. It is possible to choose from a range of proven building blocks, such as 40GHz receivers, 20GHz transmitters, and 1dB/cm passive waveguides.
Antireflective coating reduces reflections
Transparent plastic optical lenses can be manufactured cheaply and in any shape. However, a downside is that they reflect light just as much as glass does. At the K trade fair in Düsseldorf, Fraunhofer researchers are exhibiting a new type of antireflective coating that significantly reduces stray light and reflections from plastic lenses. Not only does this improve the performance of cameras and headlights, it's also good news for virtual r...
Fraunhofer develops polymer chips for many applications
"Great in Optics – Small in Size!" The growing core of the “PolyPhotonics” Innovation Initiative will take this motto to the global communications market. The project is part of the “Regional Enterprise Initiative” of the German Federal Ministry of Research. The consortium develops the value chain for the creation of a new technology platform. The Fraunho-fer Heinrich HertzInstitute HHI coordinates the project.