Search results for "siemens"

Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

Siemens Digital Industries Software has announced that SiliconAuto has adopted its PAVE360 software to streamline the development of its advanced semiconductors for the automotive sector.

Siemens Digital Industries Software launched today (February 20) the Veloce CS hardware-assisted verification and validation system.

Siemens Digital Industries Software is advancing its hardware-assisted verification portfolio with the introduction of PAVE360 software, a solution for Software Defined Vehicles (SDV) that facilitates accelerated pre-silicon development in the Cloud.

At productronica 2023, Mark Laing, Business Development Manager at Siemens, talks to Electronic Specifier’s Mick Elliott about the project Siemens have going with equipment manufacturers in the production equipment sector.

Siemens Digital Industries Software announced that it has completed the acquisition of Insight EDA, an EDA software company delivering groundbreaking circuit reliability solutions to many of the integrated circuit (IC) design teams.

Siemens Digital Industries Software has announced that INTERCHIP has used Siemens‘ Analog FastSPICE platform and Symphony platform to verify its newest IPV Voltage-Controlled Crystal Oscillator (VCXO) integrated circuit (IC) and IPS Simple Packaged Crystal Oscillator (SPXO).

Siemens Digital Industries Software has recently announced its introduction of a novel method for distributing precise thermal models of integrated circuit (IC) packages throughout the electronics supply chain.

Siemens unveiled innovations that are combining the real world and the digital worlds to redefine reality as it opened CES 2024.