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Siemens Digital Industries Software recently announced the latest advancement in its electronic systems design portfolio: the next generation release takes an integrated and multidisciplinary approach, combining Xpedition software, Hyperlynx software and PADS Profesional software into a unified user experience.

Siemens Digital Industries Software introduced Tessent Inn-System Test software, a design-for-test (DFT) solution that enhances in-system test capabilities for integrated circuits (ICs).

Siemens is spending $10.8 billion to acquire software supplier Altair Engineering.

Siemens Digital Industries Software announces it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications, and innovative technology enablement for the foundry’s newest process technologies.

Siemens Digital Industries Software has announced it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together leading international organisations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain.

Siemens Digital Industries Software has introduced Tessent Hi-Res Chain software, a new tool designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes, where even minor process variations can significantly impact yield and time-to-market.

Siemens Digital Industries Software announces that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP, and 3D-IC semiconductor designs.

Siemens Digital Industries Software announced that Dovetail Electric Aviation, a sustainable aviation company, has chosen the Siemens Xcelerator software portfolio to design zero-emission battery and hydrogen-electric propulsion systems forcommercial aircraft.

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.

Siemens Digital Industries Software announces a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.