Search results for "cliff"

Socionext has announced it is developing custom SoCs for advanced ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) using N3A, TSMC's latest 3nm automotive process technology.

A RAMP - Right Angle Multi-Position - version of industry standard XLR Connectors has been added to its connectivity product range by Cliff Electronics.

Socionext has announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and Edge-of-network markets.

Last month the Department for Health and Social Care published itsfive-year suicide prevention strategy.For the first time, this included autistic people as a priority group for tailored action at a national level. While a positive step, this is long overdue: autistic people experience a muchhigher risk of self-harm and suicidethan the general population.

MediaTek and TSMC have announced that MediaTek has successfully developed its first chip using TSMC’s 3nm process technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.

PreAct Technologies (PreAct) has released its Mojave LiDAR, a high-performance, low-cost sensor solution to address a variety of applications.

Cliff Electronicshave introduced a white version of their USB-C Male to USB-C Female Extension cables. The white version has been developed for applications such as clinical and home use medical equipment, office, general IT connectivity and for use with Cliff’s range of USB FeedThrough connectors. The existing black version is widely used as a general purpose data cable.

British engineers have successfully completed a stratospheric flight trial of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS) – PHASA-35.

Leading civil society groups and tech bodies are partnering with the UK Government to host a series of events in the run-up to the UK hosting the world’s first summit on AI safety.

SICK has unveiled a milestone advance in its three-dimensional LiDAR technology with the launch of the multiScan multi-layered LiDAR sensor.