Search results for "cliff"
Avnet & Farnell seamless sensor to Cloud integration webinar
Farnell, in collaboration with Avnet, has announced its upcoming webinar, “Start your IIoT Journey with Seamless Sensor to Cloud Integration,” scheduled for 24 July 2024, at 4 p.m. British Summer Time and 10 a.m. Central Daylight Time (US).
Omdia Research: 2023 semiconductor market revenue down 2022
Omdia’s latest Competitive Landscape Tool report reveals a downturn in the semiconductor industry, with revenue down 9% from $597.7 billion in 2022 to $544.8 billion in 2023.
Farnell unveils Design, Build, Maintain HUB
Farnell has launched its new Design, Build, Maintain HUBto support how developers, OEMs and industrial customers navigate every stage of the product lifecycle, from conception to maintenance.
Automotive camera solution that uses AI for depth-aware in-cabin sensing data
Eyeris Technologies, Inc., OMNIVISION, and Leopard Imaging, Inc. have collaborated to create a reference design aimed at enhancing safety and comfort in automotive interiors.
Compact RAMP XLR connectors can be panel mounted
A RAMP - Right Angle Multi-Position - version of industry standard XLR Connectors has been added to its connectivity product range by Cliff Electronics.
LIDAR sensor supplier signs up with Arrow
PreAct Technologies (PreAct) says its Mojave flash LiDAR sensor will be available globally through Arrow Electronics.
Omdia: AI demand leads semiconductor revenue growth
Led by continued demand for AI, the total semiconductor industry grew 8.4% in 3Q23 from 2Q23 hitting $139bn according to Omdia’s latest Competitive Landscape Tracker.
Socionext announces collaboration with Arm and TSMC
Socionext announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and edge-of-network markets.
Socionext begins development of SoCs for advanced ADAS and AD
Socionext has announced it is developing custom SoCs for advanced ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) using N3A, TSMC's latest 3nm automotive process technology.
Socionext announces Arm and TSMC CPU chiplet collaboration
Socionext has announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and Edge-of-network markets.