Search results for "TSMC"

Socionext announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and edge-of-network markets.

Alphawave Sem has announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.

Socionext has announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and Edge-of-network markets.

Cadence Design Systems has announced its digital and custom/analogue flows have achieved certification for TSMC’s latest N2 Design Rule Manual (DRM).

MediaTek has unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio.

Siemens Digital Industries Software has announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of Siemens EDA product lines for the foundry’s latest process technologies.

Synopsys has announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.

Synopsys has announced that its digital and custom/analogue design flows are certified for TSMC's N2 process technology, enabling faster delivery of advanced-node SoCs with higher quality. Both flows are seeing strong momentum, with the digital design flow achieving multiple tape-outs and the analogue design flow adopted for several design starts.

108MP cameras with enhanced noise reduction Native support for 108MP camera sensors provides impressively detailed photos. Pre-integrated multiframe noise reduction delivers a stable, clear image in low-light conditions.

There are many pieces to any semiconductor product ‘puzzle’ that can result in obsolescence. These pieces range from business revenue to any one of the subcomponents that compose semiconductor products, such as foundry process technologies, packages, substrate or lead frames, test platforms, or design resources.