Search results for "EDA"
HQ Electronics' HQDFM Design for Assembly Update
The PCB design analysis software’s new update provides valuable Design for assembly insights on PCBA production data that further helps designers reduce problems both during and after assembly.
Better now than never EDA tools deliver 192-core chip
Tachyum says that new EDA tools, utilised during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools.
photonixFAB Consortium now open for first prototyping
Pushing ahead with the European Union (EU) funded photonixFAB initiative, the consortium partners have taken the first step on the path to industrialise the European silicon photonics value chain by providing early access to R&D and small-scale manufacturing through technology partners.
µASICs developer signs Europe wide deal with Ineltek
Atlas Magnetics and distributor Ineltek have agreed a Europe-wide distribution agreement.
SEMI ESD Alliance 2024 CEO executive outlook to explore the evolving RISC-V movement
Key executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies.
Sondrel reports increasing demand for its 3nm design service
Sondrel, a provider of complex chips for leading global technology brands, reports that there is an increasing demand for its 3nm design services for custom ASICs.
nepes picks Siemens to meet 3D IC package challenges
Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.
Series 14 – Episode 5 – Architecture to PCB schematic in 60 seconds with deterministic AI
Paige West speaks with Tomide Adesanmi, Co-Founder & CEO, Circuit Mind about his journey from an electronics systems engineer to an innovator reshaping the landscape of electronics design.
Siemens product trio targets emulation and prototyping
Siemens Digital Industries Software launched today (February 20) the Veloce CS hardware-assisted verification and validation system.
INTERCHIP 3x faster verification for next-gen clocking oscillator
Siemens Digital Industries Software has announced that INTERCHIP has used Siemens‘ Analog FastSPICE platform and Symphony platform to verify its newest IPV Voltage-Controlled Crystal Oscillator (VCXO) integrated circuit (IC) and IPS Simple Packaged Crystal Oscillator (SPXO).