Search results for "EDA"

RF designis a niche skill that only a relatively small number of engineers understand. On the other hand, today’s connected world is becoming increasingly dependent on wireless technologies to link people with their lives and work, and track and monitor Internet of Things (IoT) objects that pervade homes, factories, and cities.

POSTECH researchers have found a new method of boosting semiconductors to create smarter AI.

Synopsys announces the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology.

Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and anadvance in embedded multi-die interconnect bridge (EMIB) technology.

GOWIN Semiconductor, a fast-growing FPGA manufacturer, has introduced the GW5AT-15 FPGA, designed to deliver a high-speed programmable bridging solution for demanding consumer electronics and automotive applications, such as 4K video transfer at frame rates up to 120 frames per second.

At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence Tensilica Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence Verification solution and full-flow digital implementation, including signoff.

Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.

Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.

Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.

Siemens Digital Industries Software has unveiled Tessent RTL Pro, a software solution developed to help integrated circuit (IC) design teams streamline and accelerate a broad array of critical design-for-test (DFT) tasks for their next-generation designs.