Search results for "Congatec"
congatec introduces a new carrier board design training program
congatecannounced the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.
congatec small form factor to complete high-performance ecosystem
congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.
PICMG COM-HPC 1.2 ‘Mini’ brings PCIe 5.0, USB4 & 10 GbE to far Edge
PICMG has announced the release of the COM-HPC 1.2 ‘Mini’ specification. Measuring just 95 x 70mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far Edge applications.
Building a high-performance ecosystem for Arm based SMARC modules
Congatec, a vendor of embedded and edge computing technology, is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.
Joint COM-HPC evaluation carrier board standardisation agreement
The two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardise the design schematics of COM-HPC evaluation carrier boards from both companies, and to publish most of these schematics in public design guides.
PICMG announces COM-HPC Mini Academy event
PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, 4th June at 14:00 UTC.
congatec discuss new computer-on-modules applications in ‘megatrends’|embedded world
congatec, a supplier of industrial and embedded computer-on-modules, told an exhibition hall at embedded world 2023 about the availability of its newcomputer-on-modules, and the applications thatitbelievesit'snext-gen chip can bring.
congatec welcomes COM Express 3.1 specification
congatec, a vendor of embedded and edge computing technology, welcomed the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake).
The performance boost consolidated edge applications have been waiting for
Congatec announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address applicati...
congatec introduces new ecosystem for TSN
congatec, a vendor of embedded and edge computing technology, has introduced its new ecosystem for TSN aimed at networked factories and critical infrastructures.