Search results for "Congatec"
Next-generation AI computing for the edge
congatec is introducing its latest range of COM Express Compact modules based on the IntelCoreUltra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.
Edge AI and vision processing in low power envelop
Congatec, a vendor of embedded and edge computing technology, has announced the launch of its latest SMARC module 2.1 Computer-on-Modules based on Texas Instruments Jacinto 7 TDA4x or DRA8x processors.
Top 5 IoT products in March
Electronic Specifier takes a look at the top 5 IoT products to have been released in March 2024.
congatec introduces a new carrier board design training program
congatecannounced the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.
PICMG announces COM-HPC Mini Academy event
PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, 4th June at 14:00 UTC.
PICMG COM-HPC 1.2 ‘Mini’ brings PCIe 5.0, USB4 & 10 GbE to far Edge
PICMG has announced the release of the COM-HPC 1.2 ‘Mini’ specification. Measuring just 95 x 70mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far Edge applications.
congatec small form factor to complete high-performance ecosystem
congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.
Building a high-performance ecosystem for Arm based SMARC modules
Congatec, a vendor of embedded and edge computing technology, is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.
Joint COM-HPC evaluation carrier board standardisation agreement
The two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardise the design schematics of COM-HPC evaluation carrier boards from both companies, and to publish most of these schematics in public design guides.
congatec discuss new computer-on-modules applications in ‘megatrends’|embedded world
congatec, a supplier of industrial and embedded computer-on-modules, told an exhibition hall at embedded world 2023 about the availability of its newcomputer-on-modules, and the applications thatitbelievesit'snext-gen chip can bring.