Search results for "thermal"

The topic of smart cities is becoming increasingly important in many municipalities. The digitalisation of infrastructure is intended to provide new insights and continuously improve the quality of life for citizens.

Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.

The SCHURTER OGN fuseholder is a classic that has been continuously improved and expanded with new variants. The THT variant was followed by one for SMT assembly.

Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Qorvo has announced the release of three new MMIC power amplifiers specifically designed for Ku-Band satellite communications terminals.

Melexis recently announced the expansion of its LIN RGB family with the introduction of the MLX81123.

Intel company Silicon Mobility has introduced the OLEA U310 Field Programmable Control Unit (FPCU), part of its next generation OLEA FPCU Series.

AI-powered weather forecasting, innovative heat batteries using phase-changing materials, and the rapid manufacturing scale-up of a COVID-19 vaccine are competing for a prize for engineering innovation.

IBASE Technology, a global pioneer in embedded computing solutions, proudly unveils its first ultra-compact 2.5” single board computer (SBC) designed for edge computing applications.

Applications for surface mount chip resistors with high power requirements typically mean higher circuit temperatures due to thermal resistance limitations.