Search results for "microelectronics"
Optical sensor potential in advanced driver-assisted systems
One of the key objectives of the automation space is the ability to sense the surrounding environment. The ability to view, among the various types of senses is paramount, including the capture and analysis of images and the subsequent calculation in the distances of objects, shape and motion recognition, and more.
Chip bonding adhesive delivers die shear strength of 60N/mm2
A thermally conductive, electrically insulating adhesive from DELO is available at distributor Inseto. The MONOPOX TC2270 is ideal for bonding silicon die and other applications where rapid heat transfer is essential. Heat build-up is a common reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used in automotive applications is a consdierable challenge.
Filtronic spends $1.5m to meet E-band module demand
Filtronic has invested over $1.3 million in new equipment for its manufacturing facility to meet a growing demand for both its highly-integrated E-band transceiver modules for mobile telecoms backhaul infrastructure and its precision hybrid microelectronics assembly and test services, including mmWave device packaging and sub-assembly manufacturing.
Biocompatible ALD materials for medical applications
Picosun has expanded its selection of biocompatible ALD materials to be used in medical applications. HfO2, SiO2, ZrO2, Nb2O5, Ta2O5, AlN and TiN ALD films manufactured by Picosun have been tested and validated by an independent third party to be non-cytotoxic and safe to human tissues in, for example, implant applications.
LoRA development packs democratise IoT connectivity
Two $99 ready-to-use development packs from ST Microelectronics enable all types of users from large corporations to smaller companies, independent designers, hobbyists, and schools to utilise LoRa’s long-range, low-power wireless IoT connectivity for tracking, positioning, metering, and many other applications.
IoT survey seeks engineers views and insights
Farnell has launched its second, annual IoT Survey. The survey is an opportunity for engineers designing IoT and IIoT projects to give latest insights on the market and help shape the product range and technical resources offered by Farnell to support this continually expanding and diversifying technology.
Insulation technique paves the way for more powerful chips
Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further their research.
Digital board level pressure sensor series expanded
Due to the increasing demand for precise pressure sensors suitable for manifold assembly Analog Microelectronics has expanded its digital I2C pressure sensor series AMS 5915 by corresponding variants. These PCB-mountable pressure sensors come in a robust ceramic DIP-08 package with a very low assembly height of approximately four millimetres and are designed for manifold assembly on flanges with o-ring seals.
TI and ST lift semiconductor market spirits
Texas Instruments (TI) and ST Microelectronics lifted spirits in the semiconductor industry as both reported results above expectations in their latest quarter. TI Q2 revenues dropped 9% year on year which means that revenues have declined for three successive quarters at the company.
Time-of-Flight sensors meet low power demands
A range of Time-of-Flight (ToF) sensors designed to meet the changing needs of design engineers and address demand for 3D information and extended range created by new use cases are being shipped by Farnell.