Search results for "SEMI"
Intelliconnect Europe awarded at Farnborough Air Show
The Farnborough Airshow 2024 proved to be a remarkable event for Intelliconnect (Europe) Ltd and its parent company Trexon, filled with exciting moments, significant recognitions, and valuable networking opportunities.
ROHM develops one of the industry's smallest CMOS op amp
ROHM has developed an ultra-compact 1.8V - 5V, rail-to-rail CMOS operational amplifier (op amp) - the TLR377GYZ.
UK startups raise £10 million through ChipStart programme
Eleven semiconductor startups focusing on enhancing AI efficiency and developing innovative healthcare technologies have joined a government-supported initiative designed to transform their research into commercial success.
Navitas announces new Gen-3 ‘Fast’ SiC in robust TOLL package
Navitas Semiconductor has extended its new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs into a thermally-enhanced, rugged, high-speed, surface-mount TOLL (Transistor Outline Leadless) package designed for demanding, high-power, high-reliability applications.
Inova & Lextar sign MoU for ISELED and ILaS technology
Inova Semiconductors and Lextar have jointly announced that they signed a Memorandum of Understanding (MoU) where Inova is going to provide its ISELED and ILaS technology to Lextar.
Top 5 power products in July
Electronic Specifier takes a look at the top 5 power products to have been released in July 2024.
TE Connectivity GEMnet with TI’s FPD-Link IV
TE Connectivity (TE) has equipped its GEMnet connector system to work with Texas Instruments’ FPD-Link IV SerDes semiconductors to transmit high-resolution, uncompressed video and bidirectional control over lightweight cable assemblies and connectors in the automotive environment with near-zero latency.
Nordson Electronics Solutions completes Europe location move
Nordson Electronics Solutions has announced that its Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
ASMPT die and module bonding platform
ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.
Infineon expands on Innoscience lawsuit
Infineon has expanded the Innoscience lawsuit pending before the District Court for the Northern District of California on 23 July 2024, adding claims against Innoscience (Zhuhai) Technology Company, Ltd., and Innoscience America, Inc. and based on the infringement of three additional patents referring to gallium nitride (GaN) technology owned by Infineon. In addition, Infineon has filed a complaint with the U.S. International Trade Commission (U...