Search results for "thermal"
HighPoint shipping the Rocket 7600 series AICs & adapters
HighPoint is now shipping its Rocket 7600 RAID/Pro series of PCIe Gen5 x16 NVMe AICs and Adapters.
Molex report looks at connector design trends
Molex has published a report detailing the significant role of ruggedised, miniaturised interconnect solutions in driving innovation in electronic devices across an expanding array of industries.
TiniFiber releases arc fusion splicers
TiniFiber has collaborated with FiberFox America Inc. to launch two new arc fusion splicer systems.
Pickering expands digital modules
Pickering Interfaces, a provider of modular signal switching and simulation products for electronic test and verification, has unveiled four new families of industrial digital I/O modules for both PXI- and LXI-based systems.
Siemens and Intel's partnership bears fruits
Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and anadvance in embedded multi-die interconnect bridge (EMIB) technology.
Dr Somara recognised for engineering contributions
Dr Shini Somara, an engineer, author, and television host, is set to receive one of the Royal Academy of Engineering's most prestigious accolades next month in recognition of her outstanding contribution to promoting engineering to the wider public.
magniX launches new battery product
magniX recently unveiled its latest innovation: the Samson battery line. Tailored specifically for theaviation sectorand other high-demand applications, the Samson batteries promise high performance, safety, and dependability.
Siemens advances 3D-IC adoption with Calibre 3DThermal
Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).
ASMPT showcased power module solutions at PCIM
At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution.
Heraeus joins EU project FastLane
Heraeus Electronics is pleased to announce its involvement in the FastLane project, a forward-thinking EU-funded initiative dedicated to transforming the European value chain for Silicon Carbide (SiC)-based power electronics.