Search results for "soldering"

Nordson Electronics Solutions, a global specialist in electronics manufacturing technologies, introduces the SELECT Synchro selective soldering system for high-volume printed circuit board assembly applications.

Two Indium Corporation experts are set to present at APEC 2023, 19th to 23rd March in Orlando, Florida.

Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky has been working on this key technology for some time and will present further product and process innovations in 2023 as part of additional development steps.

Arduino has announced the launch of its next-generation UNO board, a significant revision of its 8-bit technology.

The SKEDD connector family featuring patented Würth Elektronik technology has a new arrival: REDFIT WR-WSP Crimp SKEDD.

Cinch Connectivity Solutions has announced the expansion of its Johnson / Cinch Connectivity Solutions Self-Fixture Family of Connectors with three proprietary, patented solutions available in 2.92mm, 2.4mm and 1.85mm configurations.

Distrelec will showcase at embedded world 2023 tools and devices for power distribution and waveform generation as well as minimal form factor oscilloscopes.

Heraeus Electronics announces the release of its new Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste.

Plastic angled connectors with snap-in locking are sensitive to faulty handling and thus challenging in design terms.

Winbond Electronics Corporation announced that its Flash Memory products will now support the low temperature soldering (LTS) process, which reduces Surface Mount Technology (SMT) temperature from 220~260oC in the lead-free process to ~190oC.