Search results for "ASIC"
Temperature and humidity sensor is IP-67 rated
Now in stock at Digi-Key Electronics is Amphenol Advanced Sensors’ T9501 harsh-environment temperature and humidity sensor.
LASER COMPONENTS distribution agreement with iC-Haus
LASER COMPONENTS has announced the agreement of a new distribution contract with iC-Haus for the supply of their entire product range within the UK and the Republic of Ireland. There are many synergies between our companies, with both iC-Haus and LASER COMPONENTS being family-owned German based optoelectronic device manufacturers with many complementary products.
An ear to the ground for next-gen satellite connectivity
Vicor’s Factorised Power Architecture (FPA) is helping Hanwha Phasor revolutionise satellite broadband connectivity to deliver extremely high current at low voltage for uninterrupted mobile communications
Sondrel launches recruitment drive to find over a hundred engineers
The sudden need of setting up staff to work from home due to COVID-19 lockdowns presented many challenges for companies around the world. Sondrel, however, had sorted these several years earlier to ensure that all its staff could work flexibly and securely from home. As a result, business is booming and it is now actively seeking over 100 new engineers for its offices around the world.
Oscilloscope cascade increases channel counts
Four new high-end oscilloscopes from Rigol Technologies enable users to cascade a different number of modules to increase channel counts. For t
Bumps in BGA packages reduce SoC development lead times
Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process. The company has noticed increased lead times for SoC package design and manufacturing, particularly for flip chip BGAs that could impact the overall project timelines.
Multi-channel input capability added to GreenPAK Device
Dialog Semiconductor hasannounced the expansion of their popular GreenPAK solution suite with the SLG46811, the market’s smallest GreenPAK device to include an I2C communication interface.
Sondrel appoints new Regional Sales Director
Sondrel has expanded its European team with Pascal Cintract, as its Regional Sales Director for Central and Southern Europe.
Radiation-fault-tolerant power modules from Vicor
Vicor has announced the launch of its first radiation-fault-tolerant DC/DC converter power modules, housed in the new Vicor plated SM-ChiP package. Capable of powering low-voltage ASICs of up to 300 watts from a 100V nominal power source, the ChiPs were tested by Boeing to be resilient to 50krad of total ionising dose and immune to single-event upsets.
Improved performance in MEMS microphone market
Infineon has launched a next-generation analog MEMS microphone that renders better results – the XENSIV MEMS microphone IM73A135. In microphones, designers often have to accept trade-offs: high signal-to-noise ratio (SNR), a small package, high acoustic overload point, low power consumption, MEMS versus electret condenser microphones (ECM).