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Global semiconductor packaging materials market to near $30bn by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach $29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the $26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.
SiC FET lowers conduction losses
Wide Band Gap Devices like Silicon Carbide (SiC) Field Effect Transistors (FETs) are more and more considered for High-Voltage and High Power applications because of the capability of higher switching frequencies and thus better efficiency than common Silicon FETs.
Siemens and TSMC help mutual customers optimise designs
Siemens Digital Industries Software has announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of Siemens EDA product lines for the foundry’s latest process technologies.
SMC Korea 2023 semiconductor materials & sustainability in focus
Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC Korea 2023 at the Suwon Convention Centre in Suwon-si, Gyeonggi-do, South Korea.
TI helps maximise EV driving range with SiC gate driver
Texas Instruments, a specialist in high-voltage technology, debuts a highly integrated, functional safety-compliant, isolated gate driver that enables engineers to design more efficient traction inverters and maximise electric vehicle (EV) driving range.
Infineon and Infypower cooperate in new energy vehicle charger market
Power semiconductors based on silicon carbide (SiC) offer several advantages, like high efficiency, power density, voltage resistance, and reliability.
Operational amplifiers target precision applications
The ADA4099 series of high-performance operational amplifiers from Analog Devices are designed to meet the demands of modern precision applications.
Intel unveils glass substrates to advance Moore’s Law beyond 2030
Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
NeoLogic unveils novel processor design technology
Israeli processor technology startup NeoLogic is launching a processor design technology that is poised to revolutionise chip design.
New iPhone 15 releases without Lightning charger
Apple's long awaited new handset the iPhone 15 Pro and iPhone 15 Pro Max were announced this week with a notable absence of the lightning charger port. This came amid the company's annual keynote event, which saw a raft of new tech announced, including new watches and AirPods.