Search results for "transistor"

Avago Technologies claims the industry’s most energy efficient 1MBd digital optocoupler. Avago’s compact low power ACPL-M50L single channel optocoupler, which operates on approximately 80 percent less drive current than today’s standard 1MBd digital optocouplers, targets designers of communication interfaces, microcontroller system interfaces, switching power supplies, and digital isolation for A/D, D/A conversion applications.

Avago Technologies announced early prototypes have been manufactured of Avago’s proprietary five-chip family that targets the expanding 38 GHz and 42 GHz cellular radio infrastructure and backhaul point-to-point radio markets. Based on market demand and customer feedback, Avago designed the millimeter wave products for high performance in SMT (Surface Mount Technology) packages.

Fully space-qualified power devices designed and made in Europe simplify procurement as space technology targets growing commercial opportunities

STMicroelectronics has announced production availability of an analog-input 2x100W class-D power amplifier. This high-end amplifier extends the company’s range of class-D devices that deliver audiophile sound quality in components smaller than competing devices by using an advanced chip manufacturing process.

STMicroelectronics, the leader of the MEDEA+ FOREMOST “Integration of 45nm CMOS technology” Advanced R&D project, today announced that FOREMOST has been short-listed as one of three finalists for the 2010 EUREKA Innovation Award.

At the International Solid-State Circuits Conference (ISSCC) Texas Instruments disclosed process and design advancements enabling the first 45 nanometer (nm) 3.5G baseband and multimedia processor addressing critical power challenges in the wireless market. TI’s expertise in chip technologies are increasing performance while lowering power requirements in this custom solution which the company recently began sampling in fourth quarter 2007 ...

Bergquist has extended its family of S-class low-modulus gap pad materials optimised for high thermal performance by introducing Gap Pad 1500S30, which achieves thermal conductivity 1.3W/m-K and bulk-hardness rating 30 (Shore 00). The new formulation increases choice for designers seeking efficient heat removal from fragile components in cost-sensitive applications.

Texas Instruments Incorporated today introduced 10 signal conditioners designed to drive high-speed interface standards such as 10G/40G/100G Ethernet, 10G-KR (802.3ap), InfiniBand, Fibre Channel and CPRI. The new integrated circuits (ICs) join a comprehensive family of repeaters and retimers that combat signal impairments caused by insertion loss, jitter, reflections and crosstalk in high-speed enterprise servers, routers and switches.

STMicroelectronics has increased the power density achievable with its latest generation MDmesh V power MOSFET technology by introducing an advanced high-performance power package.

Latest STripFET VI DeepGATE power MOSFETs offer increased voltage ratings, delivering enhanced on-state and switching performance for DC-DC applications