Search results for "thermal"
Infineon powers Daihen's grid storage conditioner with 2,000V SiC module
Infineon Technologies has announced thatits CoolSiC2,000V modules have been selected by Daihen Corporation for their innovative unit-type power conditioners for grid storage batteries.
Lattice expands portfolio with new logic-optimised FPGAs
Lattice Semiconductor, the low power programmable specialist, has announced the addition of new, logic-optimised Lattice Certus-NXFPGA devicesto its leadership small FPGA portfolio.
Vishay's new TMBS rectifiers at Rutronik: Space-saving, high-power density
Rutronikis expanding its rectifier portfolio with five new types for 60, 100, and 150V: The surface-mount Trench MOS Barrier Schottky (TMBS) rectifier series VxNL63-M3, VxNM63-M3, VxN103-M3, VxNM103-M3, and VxNM153-M3 from Vishay come in particularly compact DFN3820A housings with wettable flanks.
Transforming Edge AI performance with Winbond's CUBE technology
Winbond’scustomised ultra-bandwidth elements(CUBE) technology is engineered to meet the rapidly growing demands of AI applications on Edge platforms.
Nanusens solves challenges of 6G RF front end design with its RF DTCs
Nanusens has announced that it has used itspioneeringMEMS-within-CMOS technology to create a novel solution to the challenge of creating better RF front ends for 6G.
Indium introduces Au-based precision die-attach preforms
Indium Corporationis proud to introduce new, high-reliabilityAu-based Precision Die-Attach (PDA) Preforms.
Silicon on insulator: from inception to cutting-edge research
Silicon on Insulator (SOI) technology has become animportant innovationin the field ofsemiconductors, driving advancements in performance, power efficiency, and thermal management of electronic devices.
TDK launches RGB series
TDK announced the launch of the RGB series, a robust range of 400 to 750W non-isolated DC-DC converters from TDK-Lambda.
400 to 750W ruggedised buck DC-DC converters from TDK
TDK Corporation has announced the introduction of the 400 to 750W rated RGB series of ruggedised non-isolated DC-DC converters from TDK-Lambda.
Adeia wins ECTC Award for “Fine Pitch Die-to-Wafer Hybrid Bonding” paper
Adeia was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. Find more industry awards, here.