Search results for "transistor"

The MOSIS Service, a leading provider of semiconductor fabrication solutions, today announced that it has expanded its relationship with IBM to now include silicon-on-insulator (SOI) technology at multiple advanced lithography nodes. MOSIS is offering IBM’s 45-nm SOI technology on 300mm wafers and IBM's 180-nm SOI technology on 200mm wafers. MOSIS customers now have a low-cost route to prototyping and low-volume production with leading-edge S...

Rochester Electronics, the world's largest authorized manufacturer and distributor of end-of-life and mature semiconductors, has reintroduced the gate array semiconductor portfolio from Applied Micro Circuits Corporation (Nasdaq: AMCC).

Magma Design Automation has announced that Dolphin Technology has standardized on the FineSim SPICE multi-CPU circuit simulation technology to accelerate delivery of high quality intellectual property (IP). Magma’s FineSim SPICE has enabled Dolphin Technology to quickly and accurately run thousands of simulations of their IP across all process corners. By increasing simulation coverage without sacrificing accuracy, FineSim SPICE enables Dolphin...

Magma Design Automation Inc. announced today that Toshiba Corporation has deployed the FineSim platform for sign-off simulation. Toshiba uses FineSim Pro with the native multi-CPU technology for its NAND flash memory development.

Magma Design Automation Inc. and MunEDA Inc. announced today the completion of a collaborative effort to integrate Magma’s FineSim SPICE simulator and MunEDA’s WiCkeD tools suite. The joint solution enhances and speeds the analysis, modeling and optimization of full-custom analog and digital circuit designs – especially in leading-edge 28-nanometer (nm) and 20-nm process technologies.

Magma Design Automation has announced the availability of a new release of the Titan Analog/Mixed-Signal (Titan AMS) Design Platform. With patent-pending analog design technology, Titan provides an innovative FlexCell-to-GDSII analog/mixed-signal (AMS) flow that organically integrates both electrical design and physical design into one unified design methodology. This paradigm-shifting, electrical-physical co-design flow ranges from front-end des...

Magma® Design Automation (Nasdaq: LAVA), today announced the availability of a proven hierarchical RTL-to-GDSII reference flow for the Common Platform™ alliance’s 32/28nm low-power process technology. This automated, comprehensive solution provides predictable results and reduces development costs for 2-million-instance and larger systems on chip (SoCs) that are manufactured at this advanced process node.

Supported by funding from the European Union’s Seventh Framework Programme, a consortium of eight leading institutions has launched a joint microelectronics research project aiming to develop innovative design methods and related EDA tools which remove the limitations in physical implementation effectiveness associated with technology scaling and advanced sub-wavelength lithography. The Synaptic consortium is composed of eight leading instituti...

At today’s International Solid State Circuit Conference (ISSCC), Holst Centre, imec and TNO present a dual-gate-based organic RFID chip with record data rate and lowest reported operating voltage. For the first time, the advantages of dual gate transistors in circuit speed and robustness have thereby been exploited in a complex organic-electronic circuit.

MSC Vertriebs GmbH presents the first COM Express modules based on the 3rd generation Intel Core processor family (formerly codenamed ‘Ivy Bridge’). The 3rd generation Intel Core processor family utilizes Intel’s advanced 22nm process technology with three-dimensional transistors for higher performance at lower power.