Search results for "soldering"
Soldercup Header & Socket Interconnects for Medium Duty Applications
Mill-Max is expanding its line of wire termination interconnects with new socket and header strips rated at 4.5 amps per contact. These connectors feature pins and receptacles with soldercups that can accept up to 20 AWG stranded & 18 AWG solid wires. They are a convenient and reliable method to make connections between discrete wires or cables and mating components such as PC boards or other cable assemblies.
Mill-Max Introduces Horizontal SMT Spring-loaded Connectors
Mill-Max introduced the new 810 series Horizontal SMT Spring-loaded Connectors. 810 series connectors are ideal for low profile spring interconnections parallel to the board surface. Applications are recharging modules, grounding points, test points and board edge-to-edge interfaces, typically to our mating target connectors.
Mill-Max Vertical Display Sockets
Series 296, 299 and 594 vertical display sockets are used to mount dot matrix and 7-segment LED displays at the edge of and perpendicular to a printed circuit board. This positions the display directly behind the translucent front panel of the equipment.
Everlight Introduces the New Yi LED Lighting Series
Everlight Electronics again expands the Lighting Series component portfolio and introduces the Yi Series - a high power, high brightness and economic (superb $/lm) LED family with 5W power consumption in a compact ceramic package.
MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball unit at SMTA Wisconsin/Great Lakes Expo & Tech Forum
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Wisconsin/Great Lakes Expo and Tech Forum, scheduled to take place August 24, 2010 at the Wyndham Airport Hotel in Milwaukee, WI.
Torenko and Associates Announces Vapor Phase Solder Seminar to be Held by IBL Technologies’ CEO Jochen Lipp at SMTA Houston Chapter Meeting
Torenko and Associates, announces that Jochen Lipp, CEO of IBL Technologies, will hold a Vapor Phase Solder seminar and onsite demonstration at the upcoming SMTA Houston Chapter meeting. The meeting is scheduled to take place Thursday, August 19, 2010 from 6-9 p.m. at TS3 Technology, Inc. in Stafford, TX. Torenko and Associates represents IBL Technologies in Texas and Mexico.
JBC Tools Announces Success at Productronica International Trade Fair
JBC Tools announces that Productronica 2011 (the International Trade Fair for Innovative Electronics Production), which took place in Munich, Germany was a great success for JBC Soldering. JBC Tools displayed several new world-class products including the “JBC Touch,” which drew a great deal of interest because of the features the unit incorporates and the ease of use of its touch screen display. Apart from the high-resolution screen ...
Circuit Technology Inc. Launches New and Improved Web Site
Circuit Technology Inc., an IPC master training organization, announces the launch of its redesigned Web site