Search results for "TSMC"

It has been announced by Synopsys, that the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies. The design platform enablement is combined with the 3D-IC reference flow.

Four ‘2018 Partner of the Year’ awards have been bestowed by TSMC upon Synopsys for Interface IP and joint development of five nanometre (nm) design infrastructure and Virtual Design Environment (VDE) Cloud Solution, plus joint delivery of the Wafer-on-Wafer (WoW) Design Solution.

The delivery of automotive-grade DesignWare Controller and PHY IP for TSMC's seven nanometer (nm) FinFET process has been announced by Synopsys. The DesignWare LPDDR4x, MIPI CSI-2 and D-PHY, PCI Express 4.0, and security IP implement advanced automotive design rules for TSMC seven nanometre process to meet the stringent reliability and operation requirements of ADAS and autonomous driving system-on-chips (SoCs).

The collaboration between Cadence Design Systems, and TSMC is set to continue, in order to certify Cadence’s design solutions for TSMC five nanometre and seven nanometre+ FinFET process technologies for mobile and high-performance computing (HPC) designs.

It has been announced that TSMC has certified the Synopsys Digital and Custom Design Platforms for the latest version of its most advanced, extreme-ultra-violate (EUV)-based, five nanometer (nm) process technology. This certification is the result of an extensive, multi-year collaboration to deliver an optimised design solution that speeds the path to next-generation designs.

As a result of a 51% forecasted increase in the China pure-play foundry market this year, China’s total share of the 2018 pure-play foundry market is expected to jump by five percentage points to 19%,exceeding the share held by the rest of the Asia-Pacific region, according to IC Insights’ September Update to The McClean Report.

IC Insights released its August Update to the 2018 McClean Report earlier this month. This update included a discussion of the top 25 semiconductor suppliers in 1H18 (the top-15 1H18 semiconductor suppliers are covered in this research bulletin) and Part 1 of an extensive analysis of the IC foundry market and its suppliers.

Apple has announced its latest iPhone models today: iPhone Xs, iPhone Xs Max and iPhone Xr. The company is attempting to create more iPhone options, while moving its whole portfolio further up into the premium segment. Apple has completed its hardware design refresh that started with iPhone X, and moves to an all-notch display line-up.

Thalia Design AutomationandCatena haveannounced successful completion of their first jointly delivered analogue IP reuse projects. The two companies have worked together to migrate Catena’s WiFi and variants of Bluetooth IP including a low power version, between multiple sub-40nm process nodes and foundry providers.

A broad cloud portfolio for the development of electronic systems and semiconductors, Cadence Cloud portfolio, has been launched by Cadence Design Systems. The Cadence Cloud portfolio consists of Cadence managed and customer managed environments that enable electronic product developers to use the scalability of the cloud to securely manage the increase in design complexity.