Search results for "transistor"
6th Generation IGBT Modules from Mitsubishi Electric
Mitsubishi Electric is launching a new IGBT family using the latest 6th generation IGBT chips with advanced CSTBTTM (Carrier Stored Trench Gate Bipolar Transistor) technology and newly developed diode chips for an optimized loss performance.
Bias tees make their mark in high frequency broadband
Just announced by Admiral Microwaves, the specialist supplier of RF and microwave components, is an expanded range of bias tees. Fabricated in the US by world-class manufacturer, Marki Microwave, the devices are available in surface mount, lead-free, RoHS compliant versions, or in traditional lead-solder packages for RoHS-exempt applications. Some units are also available with connectors.
Bernina Selects Express Logic’s ThreadX RTOS for Technology-Rich Bernina 830 Sewing System
Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that Bernina International AG has selected Express Logic’s ThreadX® RTOS for use in its advanced, state-of-the-art Bernina 830 sewing and embroidery product. The new Bernina 830, considered to be the world’s most innovative sewing and embroidery system for home users, is highly programmable, delivering touch-screen programmability, g...
Agilent Technologies Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
Agilent Technologies Inc. today announced Integrated Circuit Characterization and Analysis Program (IC-CAP) Wafer Professional (WaferPro) software. The new software provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.
Agilent Technologies - Advanced Design System for RF and Microwave High-Power Device Models Receives AMCAD Engineering Endorsement
Agilent Technologies and AMCAD Engineering today announced that AMCAD has endorsed Agilent's Advanced Design System (ADS) electronic design automation (EDA) software for the development of advanced high-power device models. Using ADS, the industry's leading RF EDA tool, AMCAD engineers have achieved a significant breakthrough in RF/microwave device modeling -- successfully modeling hot and cold operation modes of high-power devices such as amplif...
Agilent Technologies' Automated DisplayPort Compliance Test Solution Supports ROHM's DisplayPort Rx LSI
Agilent Technologies Inc. today announced that its DisplayPort compliance test solution supports automated testing of the ROHM's Receiver (Rx) IP cores for DisplayPort. The new Agilent test solution increases productivity and efficiency, and gives confidence and accuracy for chipset testing. ROHM is a manufacturer of electronic components, transistors and diodes, ICs and other semiconductor products.
Agilent Technologies' Atomic Force Microscopes Enable Advanced Studies of Photovoltaic Materials at South Dakota State University
Agilent announced that the Department of Electrical Engineering at South Dakota State University (SDSU) has installed three additional scientific-grade atomic force microscopes (AFMs). Two of the new instruments, an Agilent 5500 AFM and an Agilent 5420 AFM, will be used by the nano research group, led by Dr. Venkat Bommisetty and other researchers at SDSU.
Agilent Technologies Announces X-FAB's Worldwide Adoption of IC-CAP Device Modeling Platform
Agilent Technologies has announced an expansion of its Integrated Circuit Characterization and Analysis Program (IC-CAP) software platform at X-FAB -- a leading analog/mixed-signal foundry and expert in More than Moore technologies. The expansion is the result of a joint effort to train X-FAB's IC-CAP users on the Agilent software's measurement and extraction capabilities, including new functionality in IC-CAP 2009, as well as its application to ...
Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics
Ultrasonic Welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding is often used to join wired connections and to create connections in small, delicate circuits. Junctions of wire harnesses are often joined using ultrasonic welding. Electric motors, field coils, transformers and capacitors may also be assembl...
congatec presents the conga-TS77 COM Express Module with support for new Intel Core processor variants
congatec AG releases the conga-TS77 which supports the latest 3rd generation Intel Core processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel VT and optional Intel AMT 8.0 support.