Search results for "transistor"

NXP Semiconductors today announced the launch of the first eight products from its new 4th generation low VCEsat (BISS) transistors. The product family comes in two optimized branches – an ultra-low VCEsat and a high-speed switching branch. They are available in a voltage range from 20 V to 60 V and are housed in small SMD packages SOT23 (2.9 x 1.3 x 1 mm) and SOT457 (2.9 x 1.5 x 1 mm).

NXP Semiconductors N.V. today announced its LPC1200 Industrial Control Series featuring the ARM Cortex-M0 processor. The LPC1200 extends NXP’s 32-bit ARM microcontroller continuum and targets a wide range of industrial applications in the areas of factory and home automation, such as white goods, motor control, power conversion and power supplies. It also expands NXP’s Cortex-M0 microcontroller offering with a wide range of Flash memory sizes...

NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the introduction of the SSL 2102 integrated dimmable mains LED driver IC for SSL retrofit lamps and modules; and the launch of its online design tool for SSL applications, which makes it easy for engineers to test the behavior of LE...

NXP Semiconductors today announced two new small-signal discrete leadless packages measuring 2 mm by 2 mm with industry‘s lowest height of 0.65 mm. Available in a 3-lead (SOT1061) and a 6-lead (SOT1118) version, the plastic SMD (Surface Mount Device) packages offer an increased lifetime with an exposed heat sink for excellent thermal and electrical conductivity. The new products – including 26 types of FET-KYs, dual P-channel MOSFET, low VCEs...

NXP Semiconductors today introduced the industry’s first MOSFETs in a 2-mm x 2-mm low-profile DFN package with tin-plated, solderable side pads. These unique side pads offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.

Phyworks has introduced the first single chip transceiver in CMOS to offer an integrated ±3°C temperature sensor and diagnostic reporting. Designed for 10GBASE-SR and 1G to 8G Fibre Channel SFP+ optical applications, the PHY3070 can be used with an external junction-temperature monitoring transistor to improve module temperature sensing accuracy. This reduces measurement variance due to the influence of IC temperature.

NXP Semiconductors N.V. (Nasdaq: NXPI) has now opened registration for its first-ever High Performance RF Design Challenge, inviting RF engineers and students worldwide to submit creative application ideas for RF power devices. RF power transistors have traditionally been used in telecommunications, aerospace and broadcast infrastructure, as well as various industrial, scientific and medical applications.

Achronix Semiconductor Corp. today announced the details of the Speedster22i HD and HP product families, the first FPGAs to be built on 22-nm process technology. Speedster22i FPGAs are the industry’s only application targeted, high-end FPGAs and consume half the power at half the cost of high-end, 28-nm FPGAs.

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today reported that Cavium Networks, Inc. used NanoTime transistor-level static timing analysis (STA) solution to achieve full-chip STA signoff for its next-generation internet application processor, OCTEON II that is shipping now.

Synopsys, Inc. and Applied Materials, Inc. today announced a collaboration to develop technology computer-aided design (TCAD) models for next-generation semiconductor devices. The models derived from this TCAD collaboration will enable customers to speed up process development for 14-nanometer (nm) and 11-nm logic and new memory chip technologies, allowing them to lower cost and reduce time-to-market.