Search results for "soldering"
Juki to Showcase Its Latest Automated Assembly Solutions at IPC APEX EXPO
Juki Corporation, a world-leading provider of automated assembly products and systems, will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Finetech Hires Norm Faucher as Applications Engineer
Finetech has appointed Norm Faucher to the position of Applications Engineer effective immediately. A veteran in the electronics industry, Norm brings many years of SMT soldering expertise and customer support experience. The process knowledge he has gained from well-respected electronics assembly equipment companies will add to the strength of Finetech’s application team.
FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011
FINETECH will showcase the FINEPLACER Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
Kyzen’s Dr. Mike Bixenman to Present at the Cleaning Electronic Assemblies Workshops in Texas
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present at the upcoming technical workshops titled “Cleaning Electronic Assemblies,” that will be held at two separate locations in Texas. The first workshop is scheduled to take place Tuesday, August 2, 2011 from 9 a.m.-4 p.m. at the Doubletree Hotel in ...
New female headers “BL LP” series - low profile for THT and SMD soldering processes
Fischer Elektronik offers with immediate effect a new series of female headers with low profile in the grid size 2.54 mm. The item number is BL LP. These female headers are available in single and double-row designs. Processing is possible by applying the standard THT soldering process (wave soldering) and the SMT soldering processes (SMD and THR).
Rehm features void free Vacuum Soldering Solutions for solar and semiconductor packaging applications
Rehm Thermal Systems will showcase its newest vacuum soldering technology at this month’s Semi Con West and Intersolar exhibitions in San Francisco. Members of Rehm’s technical team will be on hand at the booth of American business partner Technica USA (#5757) to explain the numerous advantages available from this enabling technology.
Keithley Donates Model 2440 5A SourceMeter to OSUSVT
Keithley has previously donated a Model 2440 5A SourceMeter to Oregon State University’s Solar Vehicle Team, helping the electrical engineers of tomorrow characterize photovoltaic devices accurately and efficiently. OSUSVT has been using the instrument in analyzing and troubleshooting mono-crystalline silicon solar modules.
Antenova Targets Its New A10415 GPS Antenna as Ceramic Patch Antenna Replacement
Antenova announced the release of Acuta A10415 GPS Antenna, a standard GPS antenna intended to replace the ceramic patch antenna in embedded GPS applications. Antenova further announced the high performing A10415 enables substantially thinner devices, without sacrificing performance, than the typical industry standard 12x12mm2 ceramic patch antenna.
GSM/GPRS module-in-a-package from UR Group shrinks embedded wireless applications
UR Group has extended its range of dual-band GSM/GPRS data modules, giving designers the extra choice of a surface-mount module for direct soldering to the PCB, with QFN pinning and a footprint of 30.2mm x 20.8mm. UR’s new module, the Teltonika TM1, combines its small outline with a total height of only 2.87mm. This is approximately half the height of the Teltonika TM2 plug-in board introduced by UR in 2008, and brings the TM2’s comprehensive...
Miniature Half-Watt LED Package with High Lumen Output
Providing lighting design engineers with an LED source suitable for large or small, conventional or specialty lighting applications, TT electronics OPTEK Technology has developed a miniature half-watt LED package. Designated the OVS5MxBCR4 Series, the 3.5mm surface mount device is an energy-efficient LED source featuring high luminous intensity and a long operating lifespan.