Search results for "soldering"

IPC — Association Connecting Electronics Industries® announces the first annual IPC Midwest Hand Soldering Competition, September 21–22, 2011, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. Held in conjunction with IPC Midwest Conference & Exhibition, the contest will pit competitors against each other to build a functional electronics assembly within a 30-minute time limit to ultimately determine who the best-of...

The Balver Zinn/Cobar Group will feature a complete SELective soldering package at the upcoming SMTA Penang Tabletop Exhibition, scheduled to take place Friday, October 28, 2011 at the Eastin Hotel in Penang, Malaysia. The SEL package is a collection of soldering materials that is specially designed to make the most reliable assembly solder joints using a selective soldering application. The package is unique because it contains more than just ma...

SEHO North America, Inc. will showcase its SelectiveLine soldering module in Booth #237 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Atmel Corporation has announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body ...

Leading electronic components distributor Focus EDL introduces the MX16-SL micro-acoustic speaker for use in applications where a slim design is desired. Called the MX16-SL, it is a slim 3.05mm speaker with a free field resonance frequency of 600 Hz for powerful low-frequency performance with a sensitivity of 73.5 dB/W/m and an impedance of 7.5 ohm.

Vishay Intertechnology, Inc. today announced a surface-mount thin film RF capacitor with the industry's highest self- resonance frequency (SRF), which ranges from 8.5 GHz to upwards of 20 GHz depending on capacitance. The Vishay RFCS series of capacitors replaces the previous generation HPC product line.

Essemtec announces that it will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Essemtec introduced the CLM979 Radial Component Feeder that enables the assembly of through-hole LEDs on a standard pick-and-place machine. The feeder releases LEDs from the tape, cuts the wire ends and prepares the component for pickup.

There continues to be a high demand for high-quality products. This was proven once again with Essemtec's 1500-oven-anniversary celebration in May. Due to innovations and flexible implementation of customer requirements, the Swiss manufacturer has reached a leading position in the market.

Essemtec will highlight a Swiss Made, high quality SMD assembly line at the upcoming Electronica India, taking place at Bangalore International Exhibition Centre (BIEC) from September 7-10, 2010. Essemtec's solutions combine latest placement technology, Swiss quality and high flexibility with affordable prices. Essemtec’s booth will be at hall 1, lower level, booth 1230.