Search results for "Congatec"

congatec has concluded the third fiscal quarter of 2012 with record results. Sales rose to €16.7 million, corresponding to an increase of 43% compared with Q3/2011. congatec’s growth is not limited to financial performance; the number of employees has also increased by 11 in the current year, bringing the worldwide total to 135.

congatec has introduced a new Qseven Starter Kit providing developers with a complete package to rapidly prototype embedded systems for ARM designs. Thanks to their compact size and extremely low power, Qseven embedded computer modules based on ARM architectures are an ideal solution for virtually any low-power or ultra mobile embedded PC application.

congatec AG introduces a new reference board for video wall system design. Video wall systems increasingly rely on high-quality videos and (3D) graphics and therefore require a maximum number of graphics interfaces. The congatec reference board offers up to nine independent DisplayPort connectors in combination with an MXM graphics module and a COM Express CPU module.

congatec has entered into partnership with Adeneo Embedded to deliver ready-to-use board support packages for the Freescale ARM Cortex A9 i.MX 6 Series based modules. Thanks to this new software partnership, congatec’s worldwide customer base can now benefit from a cost-effective end-to-end solution enabling them to speed up the development of Windows Embedded and embedded Linux devices.

congatec AG demonstrates the broad scalability of its modules for 3rd generation Intel Core on the COM Express standard. Offering a choice of three module versions, congatec now provides maximum graphics and processing power for both Type 2 and Type 6 Pin-out.

The Qseven standard is acknowledged as one of the most flexible and powerful COM platforms for a wide variety of applications, from low power mobile devices upwards. While traditionally based on the X86 architecture, solutions are now emerging that are based on other CPUs, which deliver many benefits and offer users an even wider choice. Gunnar Holm, Field Applications Engineer with Avnet Embedded, explores further.

congatec sets another milestone offering support of the AMD Embedded R-Series platform with the new conga-TFS COM Express module based on Type 6 pinout. The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.

congatec AG is widening its sales presence in Australia and New Zealand with the opening of a new subsidiary in Queensland. Following on the heels of last month’s office opening in Japan, congatec is now directly represented with six offices on four continents – Asia, Australia, Europe and North America.

congatec AG announced that it has officially opened a Japanese subsidiary in Tokyo on 1 July 2012. Eric Hsu has been appointed as office manager of congatec Japan Ltd. Japan is one of congatec’s most important markets in Asia.

Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, has launched a single chip system companion IC to optimise the power efficiency of embedded applications using the latest Intel® Atom(TM) processor E6xx series (formerly codenamed Tunnel Creek).