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Driving The Power Electronics Revolution
Michael A. Briere discusses the first commercially viable application of GaN based power device technology, heralding a new era in power electronics through the combination of high performance and competitive costs for semiconductor power devices.
IR to Showcase Industry-Leading Power Management Solutions at electronica 2010
International Rectifier today announced it will showcase the company’s industry-leading power management solutions at electronica 2010, Munich, November 9-12, 2010.
Universal Boundary Scan tester for production integrates test electronics directly in the fixture
GOEPEL electronic recently introduced the development of JULIET (JTAG UnLimItEd Tester), a family of completely integrated stand-alone production testers. The modular systems combine all test electronics, as well as the basic mechanics in a compact desktop system. Furthermore, they are equipped with a specific interface to an exchangeable adaptor giving fast changes to accommodate different Units Under Test (UUT).
GOEPEL electronic presents new generation of Inline Onboard Programmer
GOEPEL electronic introduced RAPIDO, a new family of multi-site inline programmers designed for high-speed in-system programming (ISP) of non-volatile memory devices such as Flash, serial EEPROM, micro controller units (MCU) and programmable logic devices (PLD). RAPIDO is based on the award-winning SCANFLEX architecture, supporting the latest Embedded System Access (ESA) technologies.
New SCANFLEX Gang Tester from GOEPEL electronic improves Efficiency during Boundary Scan Utilisation in the Mass Production
GOEPEL electronic introduces SFX-TAP16/G, the worldwide first completely modular Gang test system with integrated UUT power supply. Without any additional hardware, users are now able to test or program up to 16 boards in parallel, applying only one central SCANFLEX® controller. Based on this innovative architecture, highly compact and cost-efficient Gang test applications can be implemented.
Molex Stac64 Connection System Meets Electronic Device Requirements in Today’s Vehicles
Molex has introduced the Stac64 connection system, which provides single and multi-pocket PCB solutions to offer a diverse range of circuit sizes and greatly reduce time-to-market by completely eliminating custom tooling.
Molex - Quad Small Form-factor Pluggable Plus (QSFP+) solution
Molex introduced the Quad Small Form-Factor Pluggable Plus (QSFP+) interconnect solution designed for a multitude of markets and applications including switches, routers, Host Bus Adapters (HBAs), enterprise data centres, high-performance computing (HPC) and storage. Components of the system include the Electromagnetic Interference (EMI) shielding cage, passive cable assembly, active cable assembly, optical MTP cable assembly, optical loopback an...
Molex zQSFP+ Interconnect System Meets Demand for High-Density Applications
Molex Incorporated introduces the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect solution, designed for high-density applications found in telecommunications, data networking, test and measurement and medical diagnostic equipment. Products in the zQSFP+ system support next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications and are designed to accommodate stacked and ganged connector configur...
e-con Systems Launches Capella, the World's first Embedded StereoVision Camera Reference Design for TI OMAP/DM37x processors
e-con Systems Inc. announces the world’s first Stereo Vision camera reference design based on Texas Instruments’ OMAP/DM37x family of processors and Gumstix Overo computer-on-module (COM) series. The Stereo Camera Reference design, code-named Capella, includes a DM3730-based Gumstix Overo Water Storm COM, a Gumstix Tobi expansion board and e-con’s camera daughter board e-CAM_9V024_STEREO.
IR Introduces GaN-based Power Device Technology Platform
International Rectifier Corporation has announced the successful development of a gallium nitride (GaN)-based power device technology platform that can provide customers with improvements in key application-specific figures of merit (FOM) of up to a factor of ten compared to state-of-the-art silicon-based technology platforms to dramatically increase performance and cut energy consumption in end applications in a variety of market segments such a...