Search results for "soldering"
Ideas become innovations
Since October 2022, Würth Elektronik eiSos has been cooperating in Turkey with the non-profit organisation, Cube Incubation, in Istanbul's Teknopark, where it is helping to equip an electronics laboratory for the incubation centre.
Manufacturing processes in the electronics industry webinars
In May, June, and July 2023, the event calendar of Rehm Thermal Systems is filled with new webinars on numerous topics relating to the world of electronics manufacturing.
Tresky's process development for reliable sintering with silver pastes
Recently, the German DIE bonding specialist Tresky introduced the reliable pre-sintering process with copper pastes.
Avnet Embedded launches solder-on OSM Size-S modules
Avnet Embedded presents the compact MSC OSM-SF-IMX93 OSM computing modules compliant with the new OSM 1.1 standard (Size-S) ‘Small’ with dimensions of 30 x 30mm.
Winbond sustainability initiatives and products
Winbond has announced the results of its sustainability performance along with aggressive goals and product development plans to expand that leadership in 2023.
OSM computing modules cut connector, cuts costs
The compact MSC OSM-SF-IMX93 OSM computing modules from Avnet Embedded are compliant with the new OSM 1.1 standard(Size-S) “Small” with dimensions of 30 x 30mm.
RFID Tag with Nano Copper Antenna on Paper
Goal: design and print a high-performance ultra-high frequency (UHF) RFID tag using precision dispensing of nano copper ink on a paper substrate.
Miniature CO2 sensors break size barrier
Sensirion has launched the SCD4x series of next generation miniature CO2 sensors along with an evaluation kit SEK-SCD41 which helps developers accelerate their designs.
Indium Corporation materials for power electronics at PCIM
Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.
New photo microsensor extends transmissive photo IC portfolio with 3mm slot width
Omron Electronic Components Europe has extended its SMD photo IC portfolio with the introduction of a compact 3mm slot variant.