Search results for "soldering"
Vishay Intertechnology Releases New 15 A and 25 A Single-Phase Single In-Line Bridge Rectifiers With Low Forward Voltage Drop Down to 0.73 V for Improved Power Efficiency
Vishay Intertechnology, Inc. releases two new single-phase single in-line bridge rectifiers in the GSIB-5S package with improved VF over previous-generation devices − down to 0.73 V at + 125 °C − and high forward surge current capability
Bright LED technology thanks to correct resistors
LED technology is becoming an increasingly popular choice for lighting up the headlights of modern cars as well as their displays and cockpits. Special resistors are necessary to make the diodes work properly.
Melexis achieves MOST compliance twice over for Fiber optic Transceivers in SMD package
Melexis recently received the declaration of compliance for both its MLX75608 and MLX75605 Fiber optic transceivers. These fiber optic transceivers (FOTs) are suitable for 25Mbit/s (LVTTL) and 150Mbit/s (LVDS) communication respectively. The double compliance confirms the role of Melexis as innovative driver towards Surface Mount Device (SMD) solutions that will offer increased performance at lower cost.
Murata launches ultra low-profile surface mount 2.4 kHz piezo sounders
Murata today announced the expansion of its PKLCS family with two new 2.4 kHz SMD piezoelectric sounders aimed at automotive applications. Both the consumer part PKLCS1212E2400-R1 and the automotive/industrial part PKLCS1212E24A0-R1 are available in low profile surface mount packages. They have a 5dB increase in sound pressure level compared to previous Murata devices, and are fully reflow solder compatible. They are ideally suited for applicatio...
Sharp presents the new generation of 10W LED arrays
The new product generation is based on the technical advances made in LED production, improving the efficiency by up to 47%. The 2nd generation of the 10W arrays has four distinguishing features in this regard: they are compact, lightweight, economical and significantly brighter than before.
TE Connectivity designs solderless LED socket for new Nichia Chip-on-board LEDs
TE Connectivity announces a new addition to its solderless LED socket series -- the Type NL2 socket for quick termination of NICHIA COB-L LEDs. This new offering, which provides a reliable mechanical and electrical connection of an LED onto a heat sink, enhances TE’s existing broad portfolio of solderless LED sockets.
Bright Led Technology Thanks To Correct Resistors
Isabellenhütte Heusler convinces automotive suppliers LED technology is becoming an increasingly popular choice for lighting up the headlights of modern cars as well as their displays and cockpits. Special resistors are necessary to make the diodes work properly.
Practical Components & Practical Tools to Showcase Latest Technologies at DMC 2010
Practical Components, a leading international supplier of solder training kits and materials, mechanical IC samples or “dummy” components and SMD production tools and equipment, and its sister company Practical Tools announce that they will exhibit their latest technologies in booth 910 at the 2010 DCM exhibition and conference, scheduled to take place November 29-December 2, 2010 at The Venetian in Las Vegas.
New 1 watt converters for low power applications
DENGROVE introduce RECOMs new 1 watt converters which are designed for low power applications. The new R1S/E-, RB/E- and RO/E-converter series with low rated power achieve excellent efficiency up to 84%. More importantly, they reach 70% efficiency even at 20% load. Low heat losses allow these converters to be used at the extended ambient temperature range of -40°C to +100°C without derating.
Senju appoints Inseto as its UK Distributor
The PCB Assembly Products Division of Inseto has announced that it has been appointed as the new UK distributor for Senju. Senju manufactures a comprehensive range of electronics grade solders and related materials including paste, wire, spheres, bar and flux, and are renowned for their leadership in lead-free soldering materials, which were introduced and patented in Japan during 1993, over 14 years ago.