Search results for "soldering"
Wieland Electric Introduces Pluggable Printed Circuit Board Terminals
Wieland Electric Inc introduces its new pluggable printed circuit board (PCB) terminals. Wieland’s 3.5 millimeter pitch high density PCB connector provides an extremely high density design while still maintaining a pitch that is easy to work with. The angled PCB headers are particularly designed for contacting automation technology control devices or controllers.
New ways to harness energy at the press of a button
With the ECO 200, EnOcean is launching the third generation of its mechanical energy converters. Combined with the PTM 330 transmitter module the result is an entire system for batteryless wireless operations. This new pairing creates an optimum basis for speedy and simple implementation of energy harvesting switching solutions. EnOcean again shows the way for new possibilities of various self-powered wireless switching elements – in building a...
SiTime Introduces Industry’s First MEMS VCTCXO with ±0.5 PPM Stability
VCTCXO Products with 1 to 220 MHz Frequencies, Industrial Temperature and 500 fs Jitter are Optimized for Telecom, Networking, and Wireless Applications
Fleetwood Group Places Order for Juki’s FlexSolderWave FSW620
Juki Automation Systems, a world-leading provider of automated assembly products and systems, announces that it has received a purchase order from Fleetwood Group for its FlexSolderWave FSW620.
BTU International’s PYRAMAX Solder Reflow System Wins Global Technology Award
BTU International announces that it has been awarded a Global Technology Award in the category of Soldering Equipment for the new dual-lane, dual-speed capabilities of its PYRAMAX solder reflow system. The award was presented to the company during a Tuesday, November 15, 2011 ceremony that took place at the New Munich Trade Fair Centre in Munich, Germany during Productronica 2011. This marks BTU’s 15th industry award in the past five years, and...
FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011
FINETECH will showcase the FINEPLACER Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.
MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011
MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International conference & exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Kyzen Promotes Debbie Carboni to National Electronics Sales Manager
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces the promotion of Debbie Carboni to National Sales Manager.
Kyzen to Display MICRONOX® MX2302 Wafer-Level Cleaning Solution at IMAPS 2011 – Long Beach
Kyzen will display its MICRONOX® MX2302 Wafer-level Cleaning Solution in Booth #517 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 9-13, 2011 at the Long Beach Convention Center in Long Beach, CA.
See Eco-Friendly Advanced Electronics Cleaning Solutions by Kyzen
Kyzen Corporation announces that it will showcase its products for any process including AQUANOX® A4703, AQUANOX® A4625B and IONOX® I3302 in booth 2F10 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.