Search results for "SiC"
Infineon's solutions at PCIM
At PCIM Europe 2024, Infineon Technologies will demonstrate how its latest semiconductor, software, and tooling solutions address the challenges of today's green and digital transformations.
Navitas showcase GaN and SiC power semiconductors at PCIM
Navitas Semiconductor will introduce and display an expanded portfolio of gallium nitride (GaN) and silicon carbide (SiC) power products at PCIM 2023.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Infineon drives decarbonisation and digitalisation for a greener future
At PCIM Europe 2024, Infineon Technologies will showcase its latest semiconductor, software, and tooling solutions addressing today’s green and digital transformation challenges.
C2000™ 32-bit MCU 120-MHz 384-KB flash, FPU, TMU with CLA, CLB, AES and CAN-FD
The TMS320F28003x (F28003x) is a member of the C2000™ real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of GaN and SiC technologies.
PowerUP Asia 2024: challenges, trends, and latest innovations
Leading power semiconductor companies will be discussing the latest power semiconductor development trends and innovations, and how these are helping the drive toward greener electronics, at the upcoming PowerUP Asia 2024 virtual conference.
Apple announce new accessibility features for iPad and iPhone
Apple has announced new accessibility features coming later this year, including Eye Tracking, a way for users with physical disabilities to control their iPad or iPhone with their eyes.
Automotive, 2.0-W, 24-Vin, 25-Vout high-density > 3-kVRMS isolated DC/DC module
UCC14240-Q1 is an automotive qualified high isolation voltage DC/DC power module designed to provide power to IGBT or SiC gate drivers. The UCC14240-Q1 integrates a transformer and DC/DC controller with a proprietary architecture to achieve high efficiency with very low emissions. The high-accuracy output voltages provide better channel enhancement for higher system efficiency without over-stressing the power device gate.
Sphere Entertainment acquires HOLOPLOT
Sphere Entertainment announces that it has acquired all of the remaining shares it did not previously own of HOLOPLOT, a global pioneer in 3D audio technology.
New 2,200V silicon carbide MOSFETs
Toshiba Electronics has developed a new 2,200V rated silicon carbide (SiC) MOSFET with embedded Schottky barrier diode (SBD) for use in 1,500V DC applications such as photovoltaic (PV) inverters, electric vehicle (EV) chargers, high frequency DC/DC converters, and energy storage systems.