Search results for "TSMC"
Lattice expands low power FPGA range
AtLattice Developers Conference 2024,Lattice Semiconductorexpanded its Edge to Cloud FPGA innovation leadership with the launch of exciting new hardware and software solutions.
Intel names Meurice and Sanghi to board of directors
Intel has added semiconductor-manufacturing and product development heft with the appointment of Eric Meurice, former president, chief executive officer and chairman of ASML and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology.to Intel’s board of directors, effective immediately.
Infineon and Stellantis to advance innovation in power conversion and distribution
Stellantis and Infineon have announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.
Series 16 – Episode 7 – The role of semiconductors in future mobile gaming innovation
Paige West speaks with Rob Moffat, Deputy Director Sales & Business Development Europe at MediaTek about the role of semiconductors in the future of mobile gaming innovation.
Advantest highlights test innovations at ITC 2024
Advantest will feature its latest test solutions for advanced ICs at the 2024 International Test Conference (ITC) at the Hilton San Diego Bayfront (November 3-8).
Omdia analyses LCD and OLED driver IC markets
Omdia’s Display Driver IC Market Tracker indicate that NexChip and Samsung Foundry have emerged as key leaders in the display driver IC (DDIC) market for 3Q24.
Analog Devices expands partnership with TSMC
Analog Devices has disclosed a strategic collaboration with TSMC, the foremost dedicated semiconductor foundry globally, to secure a long-term supply of wafer capacity from Japan Advanced Semiconductor Manufacturing,a subsidiary of TSMC with a majority ownership located in Kumamoto Prefecture, Japan.
Silicon-proven 3nm, 24Gbps UCIe IP subsystem
Alphawave Semihas announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.
Avnet ASIC Israel ties up VCA deal with TSMC
Avnet ASIC Israel, a provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica has been appointed as a Value Chain Aggregator (VCA) by TSMC, the world's leading silicon foundry.
NVIDIA announces Blackwell & Hopper MLPerf results
NVIDIA has announced the results of the recent MLPerf Inference v4.1 for its new Blackwell and Hopper architecture, showing strong results.