Search results for "SEMI"
The programme: digital additive and/or 3D electronics
TechBlickhascurated a programmefeaturing over 70 invited talks, 12 industry- or expert-led masterclasses, four tours, and more than 80 onsite exhibitors.
Infineon pioneers world’s first 300mm power GaN wafer technology
Infineon has announced that the company has succeeded in developing the world’s first 300mm power GaN wafer technology.
Penn adjusts forecast amid semiconductor market strife
The bullish recovery in the semiconductor market, which began in Q2 2023, is now faltering. Q4 2023 grew at an above average 8.4 per cent growth in Q4 2023.
TASKING boosts support for NXP automotive microcontrollers
TASKING, recently promoted toNXPGold Partner status, has enhanced its tools support to optimise and accelerate software development for NXP Semiconductors’ automotive microcontrollers and processors.
Advantest lines up test solutions for SEMICON India
Semiconductor test equipment supplier Advantest will feature its leading-edge IC test solutions at the first-ever SEMICON India at the India Export Mart (IEML) in Greater Noida (Sept. 11-13).
Nidec Group companies to exhibit at IMTS 2024
Nidec announces that Nidec Group companies of Nidec Machine Tool Corporation, Nidec OKK, Takisawa Machine Tool, and PAMA, will exhibit their products at IMTS 2024, the largest manufacturing technology exhibition in the US, to be held in the city of Chicago, Illinois, from 9–14 September 2024.
Nidec OKK to unveil pallet stocker and VB-X350 at AMB 2024
Nidec OKK has announced that it will launch a multi-level pallet stocker that boasts a best-in-class space efficiency, and is installed in five-axis vertical machining centre VB-X350.
UWB device combines secure ranging and short-range radar
NXPSemiconductors has unveiled theTrimensionSR250, said to be the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Tomorrow's E/E architectures require new semiconductors
What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?
DELO carries out studies on miniLED dice
DELO has carried out internal feasibility studies, demonstrating the successful electrical and mechanical bonding of miniLED dice using directional conductive adhesives.