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GaN Systems has announced special pricing for its gallium nitride evaluation kits for customers who pre-order at the APEC (Long Beach, Ca, March 17-21) and PCIM (Nuremburg, Germany, May 14-16) power events.

Efficient Power Conversion today announces the availability of the EPC9005 development board, featuring EPC’s enhancement-mode gallium nitride field effect transistors. This board demonstrates how IC gate drivers, optimized for eGaN FETs, make the task of transitioning from silicon to eGaN technology simple and cost effective.

GaN Systems announced today the opening of a new office facility located in Reading, England. This expansion of the Company’s European operations will aid the Company in continuing to impact key industries, like manufacturing and automotive, where the need for clean technology power conversion applications continue to grow. GaN Systems’ head office is currently located in Ottawa, Canada.

As the benefits of LED lighting technology and its countless applications propel its rapid expansion into a growing number of industries, new products using arrays of LED components appear almost daily. Accordingly, the demand for LED-specific component placement equipment is becoming more widespread and is no longer viewed as something reserved only for offshore manufacturers.

Symtavision has announced the addition of Ethernet timing analysis to its SymTA/S tool for the design and verification of embedded real-time systems. The new Ethernet timing analysis targets the automotive market and integrates seamlessly with the existing in-vehicle network timing analyses for CAN and FlexRay as well as with scheduling analysis for AUTOSAR-based ECUs.

Intertec opens an advanced new production facility, greatly expanding its ability to fabricate shelters, cabinets and enclosures for protecting process instrumentation. Representing an investment of $3 million, the expansion project provides the company with its second build-to-demand CNC machining line.

Molex Incorporated introduces modular, stackable HS Stac headers that combine the high-speed USCAR-30 HSAutolink interface with the modular, stackable configuration of the versatile Stac64 connector system. With a 0.80mm pitch, the new HS Stac headers achieve greater design-flexibility and space-savings in PCB trace-routing for in-vehicle infotainment and telematic devices.

For the second straight year, Yole Développement and Serma have joined forces to organize the Successful Semiconductor Fabless conference, a unique European event dedicated to the fabless business model. This event takes place in Paris, from April 10 to 12. In the 1970’s, the semiconductor industry was vertically integrated. Most companies were IDMs with manufacturing, design, intellectual property and marketing activities.

Europlacer will highlight the new ii-Feed, the multi award-winning iineo platform and the market-leading Speedprint SP710avi in booth #1C40 at the upcoming NEPCON China exhibition and conference, scheduled to take place April 23-25, 2013 at the Shanghai World Expo Exhibition & Convention Center in Shanghai.

API Technologies is pleased to announce that they will showcase their diverse range of products suitable for higher power applications during the 2013 Annual Applied Power Electronics Conference & Expo (APEC). Discussions and live demonstrations will take place at the API Technologies Booth #91, featuring its Spectrum Control line of EMI power filters, film capacitors, switch mode power supply capacitors, magnetics, and the latest in current limi...