Search results for "Congatec"
Quick Starter Kit for SMARC 2.0 aids Intel Atom processors
congatec presents the SMARC 2.0 Quick Starter Kit for Intel Atom processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel Atom processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wir...
Low power processor modules available for every budget
congatec has released COM Express Compact and Qseven Computer-on-Modules in time with the launch of Intel’s low-power processors (code name Apollo Lake).The modules with Intel Atom, Celeron and Pentium processors feature the powerful Intel Gen 9 graphics and deliver an impressive performance per watt improvement, enabling the implementation of even more powerful designs with even lower energy consumption.
First COM Express Type 7 modules with Intel Xeon D processors
Parallel to the preview release of the COM Express Type 7 specification, congatec is introducing new Server-on-Modules with Intel Xeon D processors (codename Broadwell).Based on the COM Express Basic standard form factor (95x125mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48GB of DDR4 ECC RAM.
SGET e.V. hosting own stand at electronica
electronica 2016 will see the international Standards Group for Embedded Technologies e.V. (SGET) hosting for the first time the group’s own exhibition stand, in Munich from 8th-11th November.
IoT gateway is flexible for rapid field deployment
Application ready and easily customisable for rapid field deployment, congatec has introduced its highly flexible IoT gateway system. The gateway offers extreme levels of flexibility in terms of processing performance and software integration, able to host up to eight wireless antennas that can be connected to three mini PCI Express slots and six internal USB based slots for wireless and wired connectivity modules.
Embedded systems: The future of the industry at electronica 2016
“Connected Worlds—Safe and Secure” is the motto of an exhibition sector at electronica, the International Trade Fair for Electronic Components, Systems and Applications, that revolves around the latest operating systems and networking technology in the electronics applications sector.
Embedded COM tech supports new module specification
Full support of the new SMARC 2.0 specification, which was released by the Standardisation Group for Embedded Technologies e.V. (SGET) just a few days ago has been announced by congatec. This major technology adaption extends congatec’s leading and extensive COM portfolio to include a brand new solution which is perfectly positioned between Qseven and COM Express.
Server-on-Modules enable real-time media processing
congatec has introduced two Server-on-Modules based on the latest Intel Xeon E3-1578L and E3-1558 processors, which have been designed for real-time media processing. The conga-TS170 modules feature integrated Intel Iris Pro Graphics accelerated by 128MB fast eDRAM and double graphics base frequency for outstanding transcoding and video processing performance.
Modules integrate most cost efficient Intel Celeron processor
congatec increases the scalability of its COM Express Computer-on-Modules with two entry-level models based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The Intel Celeron processor-based COM Express Basic and Compact modules combine cost efficient dual-core CPU performance with state of the art features such as 4k multiscreen support, high-speed DDR4 RAM with increased bandwidth and four USB 3.0 ports.
A roadmap for SMARC 2.0, Qseven 2.1 & COM Express 3.0
congatec has announced that it fully supports the upcoming new SGET and PICMG CoM specifications SMARC 2.0, Qseven 2.1 and COM Express 3.0. Modules complying with these standards are already in development and will be announced in time with the launch of the next processor generations.