Search results for "Infineon"

Infineon Technologies AG introduced its latest family of single P-channel 40V automotive power MOSFETs produced using advanced trench technology. The new 40V OptiMOS P2 products strengthen Infineon’s leadership in power management for next-generation automotive applications by setting new benchmarks in improved energy efficiency, reduced CO2 emissions and cost savings.

Infineon Technologies AG today announced its intelligent Signature Watchdog CIC61508. In combination with the company’s powerful 32-Bit TriCore microcontrollers and the dedicated SafeTcore software, the CIC61508 can provide monitoring features compliant up to the highest risk level of functional safety according to the IEC61508 and ISO26262 automotive industry standards. The CIC61508 is a safety watchdog which can be integrated into safety rele...

Whether in the powertrain, in central control units or in body and convenience electronics – there is a constant increase in the proportion of electronic components used in the car. This trend is accompanied by growing complexity of the systems installed, meaning that designers are forever faced with new challenges in the fine tuning. Six partners from all levels of the development chain have now joined forces in a quest to come up with overarc...

Infineon Technologies AG today introduced the latest generation of its High Speed CAN transceivers designed for automotive network applications: the TLE7250 family comprising the TLE7250G and the TLE7250GVIO. While the TLE7250G interfaces with 5V microcontrollers, the TLE7250GVIO has a voltage reference input, enabling either a 5V or a 3.3V microcontroller I/O interface. Compared to the previous generation, the new transceivers offer improved imm...

Energy efficiency and environmental compatibility are two of the most important challenges facing the automobile industry. Automobile electronics can provide numerous solutions for future automobiles and is also therefore one of the fastest growing markets in the automotive sector. Around 20% of exhibitors at electronica 2010, the world’s leading trade fair for components, systems and applications for the electrical engineering and electronic...

Altium Limited today announced the release of a new TASKING VX-toolset for the C166/ST10 microcontroller family which offers substantial performance gains over traditional C166 development tools. Initial benchmarking of the TASKING VX-toolset for the C166/ST10 microcontroller family indicates that it provides an average improvement of 45% in code compression and 24% in code speed optimization, enabling customers to deliver high-quality applicatio...

Advansus, a joint-venture motherboard manufacturer of ASUS and Advantech, announces the roll out of i965GM-DCQI, an Intel GME965 Mini-ITX motherboard designed for high definition video gaming machines and digital signage systems. The i965GM-DCQI Mini-ITX motherboard delivers excellent user experience with 3D graphics, dual-view display, dual audio streams, a 6 watt audio amplifier, dual LAN and an onboard Trusted Platform Module (TPM) providing a...

GOEPEL has developed a dedicated model library for the Infineon processor family, XC16x that supports the innovative emulation technology VarioTAP. The libraries, described as VarioTAP models, are structured modularly as intelligent IP and enable a complete fusion of Boundary Scan test and JTAG emulation. By employing this technology, embedded and external flash can be in-system programmed with the help of the processor function. Furthermore, Var...

Silica is appearing at this year’s Embedded World fair in Nuremberg (March 2nd – 4th, 2010) entirely under the banner of “Networking for automation systems”. There will be a live demonstration of controlling a high-stack shelving system based on EtherCAT (Ethernet for Control Automation Technology) standards. The high-stack shelving system is used as an example to show how many things industrial Ethernet can do.

IBM Corporation and NEC Electronics Corporation announced they have entered into a multi-year joint development agreement under which they will develop next-generation semiconductor process technology.