Search results for "Infineon"

During the CEO Round Table at electronica 2010, the CEOs of four leading semiconductor manufacturers will discuss the lessons which the electronics industry has learned from the crisis in 2008 and 2009. On 9 November 2010, the first day of the show, the CEOs will explain why their industry has been so badly affected and how the market has changed since then.

Electro-mobility and all it offers continues to dominate the headlines. However, it remains to be determined how the automotive industry will adopt and implemement the changes that technology has to offer. This question will be one of the most important topics at electronica 2010 (November 9 to 12, 2010, New Munich Trade Fair Center).

For many years, electronica has provided a biennial shop window for the global electronics industry and, over time, has become the largest event of its kind in the World. The 2010 fair was attended by more than 72,000 visitors from 76 countries and 2,578 exhibitors from 46 countries and this year’s show is on track to be equally as successful.

IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance.

Arrow has received two new European awards from Infineon. The first recognises Arrow as the distributor that delivered the most significant growth of design-in activities across Europe. The second award goes to Arrow’s Nordic operation, which has been named as Infineon’s Best Distributor for the Nordic region.

Dialog Semiconductor, a provider of power management semiconductor solutions has announced a strengthening of its senior management team with the appointment of Mark Tyndall as Vice President - Business Development and Corporate Strategy.

Fairchild Semiconductor and Infineon Technologies, today announced a packaging partnership for their power MOSFETs in the MLP 3x3 (Power33™ or S3O8) and PowerStage 3x3 packages. The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in DC-DC conversion. It takes advantage of the expertise both companies offer for asymmetric, dual and single MO...

Test solutions specialist A.T.E. Solutions has been appointed as exclusive UK representative for Algocraft and its WriteNow! In-System Programming (ISP) products. Under the appointment A.T.E. Solutions will provide technical support for Algocraft’s products and be able to integrate the ISP capability into its custom test solutions.

Andi Guan talks about the impact of smart grids on electricity costs and the future role of consumers.

Yole Développement's FOWLP Patent Analysis is now available. Fan-Out Wafer Level Packaging is the most innovative advanced packaging technology today, adopted for mobile phone and consumer electronics applications. After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis of the technical contents of patents.